Patents Assigned to SUMIKA TECHNOLOGY CO., LTD.
  • Publication number: 20230367049
    Abstract: The present invention addresses the problem of providing a colored composition capable of forming a color filter having excellent UV ashing resistance. This problem is solved by a colored composition comprising an alkali soluble resin and a colorant containing a compound represented by formula (I): wherein L1 represents a group represented by formula (ph1), A represents a group represented by formula (ia), and B represents a group represented by formula (ib).
    Type: Application
    Filed: September 22, 2021
    Publication date: November 16, 2023
    Applicants: SUMITOMO CHEMICAL COMPANY, LIMITED, DONGWOO FINE-CHEM CO., LTD., Sumika Technology Co., Ltd.
    Inventors: Hitomi MANABE, Yu TAKAISHI, Sho TSUJIUCHI, Manabu TOGAI
  • Publication number: 20140311663
    Abstract: Methods of fabricating a flexible color filter and a flexible color display device are provided. A bonding substrate is firstly provided. The bonding substrate includes a rigid supporting substrate and a carrier-free adhesive layer, in which the carrier-free adhesive layer is disposed on the rigid supporting substrate. Next, a flexible substrate is adhered on the carrier-free adhesive layer, and a color filter layer is then formed on the flexible substrate, so as to form a color filter module. Subsequently, a cooling process is performed to separate the flexible substrate from the bonding substrate, thereby obtaining the its flexible color filter.
    Type: Application
    Filed: April 22, 2014
    Publication date: October 23, 2014
    Applicant: SUMIKA TECHNOLOGY CO., LTD.
    Inventors: Kung-Yi CHAO, Ying-Jie WANG, Chang-Huan WU, Kui-Fei TENG
  • Publication number: 20130220796
    Abstract: A composite target and method for manufacturing the same are described, which manufactures the composite target according an etching condition of a waste target. The waste target is generated after an original target at least haying a substrate layer and a metal layer is processed through a sputtering process by a sputtering apparatus with a first magnetic field line distribution. By determining the etching condition caused by the first magnetic field line distribution, a magnetic layer with a second magnetic field line distribution is decided to dispose on the original target. The metal layer is formed on the substrate layer and/or the magnetic layer. The substrate layer, the magnetic layer and the metal layer are combined by a connection layer to form the composite target. The composite target can provide the second magnetic field line distribution to adjust the first magnetic field line distribution.
    Type: Application
    Filed: February 23, 2013
    Publication date: August 29, 2013
    Applicant: SUMIKA TECHNOLOGY CO., LTD.
    Inventor: SUMIKA TECHNOLOGY CO., LTD.