Abstract: Pin-finned heat sink having good heat dissipating characteristics satisfy the following inequality: ##EQU1## where d is the diameter of pins, c is the distance between pins, and h is the height of pins. This heat sink can increase the level of integration of semiconductor devices with which it is used.
Type:
Grant
Filed:
July 9, 1993
Date of Patent:
November 29, 1994
Assignees:
Sumitomo Metal Industries, Ltd., Sumikin Precision Forge Inc.