Abstract: Provided is a photosensitive resin composition containing a polyamide resin and/or a polyimide resin, in which, in a case where a cured film obtained by heating the photosensitive resin composition at 170° C. for 2 hours is subjected to a dynamic viscoelasticity measurement under the following conditions, a storage elastic modulus E?220 at 220° C. is 0.5 to 3.0 GPa. [Conditions] Frequency: 1 Hz, Temperature: 30° C. to 300° C., heating rate: 5° C.

Abstract: The present invention provides a medical device having a structure with excellent operability. According to the present invention, there is provided a medical device (100) including: an elongated medical device body (10); a first operation wire (41) and a second operation wire (42), each of which extends along a longitudinal direction of the medical device body (10); and an operation part (70) that is configured to individually and simultaneously pull the first operation wire (41) and the second operation wire (42), in which the first operation wire (41) and the second operation wire (42) are disposed at opposite extreme positions in a transverse section of the medical device body (10).

Abstract: The resin composition for injection molding according to the embodiment of the present invention contains at least one kind of wax (a) having a melting point of lower than 80° C.

Abstract: The present invention relates to photosensitive compositions containing PFAS-free polynorbornene (PNB) copolymers and terpolymers in combination with certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PFAS-free PNBs and certain multifunctional crosslinking agents, and two or more phenolic compounds which are resistant to thermo-oxidative chain degradation and exhibit improved mechanical properties.

Abstract: The present invention relates to photosensitive compositions containing PFAS-free polynorbornene (PNB) terpolymers and certain additives that are useful for forming microelectronic and/or optoelectronic devices and assemblies thereof, and more specifically to compositions encompassing PFAS-free PNBs and certain multifunctional crosslinking agents, and two or more phenolic compounds which are resistant to thermo-oxidative chain degradation and exhibit improved mechanical properties.

Abstract: Provided is a phenolic resin composition containing a water-soluble resol-type phenolic resin and glycine, in which the phenolic resin composition is obtained through a step of reacting phenols and aldehydes, which are starting substances, in a presence of a basic catalyst under a condition that a molar ratio of [aldehydes]/[phenols]is 0.8 or more and 4.5 or less, to obtain a water-soluble resol-type phenolic resin, and a step of adding glycine to the resol-type phenolic resin in an amount of 0.001 mol % or more and less than 0.1 mol % with respect to the phenols as the starting substance, to obtain the phenolic resin composition.

Abstract: A biomedical electrode according to the present invention includes: a plate-shaped support portion; an elastic pillar portion that is provided on a first surface of the plate-shaped support portion; and a conductive resin layer that is formed to cover a distal end of the elastic pillar portion, in which when measured at 37° C. according to JIS K 6253 (1997), a type A durometer hardness of a surface of the elastic pillar portion is higher than 35 and 65 or lower.

Abstract: The present invention provides a flame-retardant insulating sheet containing a polycarbonate resin and a flame retardant, in which the flame retardant includes a nitrogen-containing compound, and on at least one surface of the flame-retardant insulating sheet, an arithmetic mean peak curvature (Sp) is 200 (1/mm) or more, a peak density (Spd) is 8,000 (1/mm2) or more, or a 60° glossiness is 25 or less. An electrical/electronic device using the flame-retardant insulating sheet.

Abstract: A thermosetting resin composition used for forming a sealing member (65) in a state (4) that includes: a stator core (41) having a plurality of tooth parts (7) and a plurality of slots (8) formed in an alternating manner in a circumferential direction, a coil (9) wound around the slot (8) and accommodated in the slot (8), and having a pair of coil ends respectively protruding toward both sides in an axial direction from the stator core (41), and a sealing member (65) provided in the slot (8) by covering the coil (9), the thermosetting resin composition including an epoxy resin, a curing agent, and an inorganic filler and having a lowest melt viscosity of equal to or less than 40 Pa·s.

Abstract: A photosensitive resin composition including an alkali-soluble resin, a photoacid generator, a first organic solvent, and a second organic solvent different from the first organic solvent, in which the alkali-soluble resin includes at least one selected from a polyamide resin, a polyimide resin, and precursors thereof, the second organic solvent includes a heterocyclic compound having a carbonyl group (provided that N-methyl-2-pyrrolidone is excluded), and the amount of the second organic solvent is 0.001% by mass or more and 4.0% by mass or less with respect to the entire photosensitive resin composition.

Abstract: A sealing resin composition including an epoxy resin, a curing agent, an inorganic filler, and rubber particles, in which a toughness index of a cured product of the sealing resin composition at 25° C. is equal to or more than 80 and equal to or less than 100.

Abstract: A heat radiating substrate (10) includes an insulating layer (11) and a circuit pattern (20) of a metal formed on the insulating layer (11) in direct contact with the insulating layer (11), in which a side surface (that is, metal layer side surface (23)) of the circuit pattern (20) has a region in which an angle ? formed by a surface (insulating layer upper surface (11a)) of the insulating layer (11) (insulating substrate) and a tangential line L at a middle portion (X1) in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less.

Abstract: A negative-type photosensitive polymer of the present invention is a solvent-soluble negative-type photosensitive polymer which has a structural unit containing an imide ring, the negative-type photosensitive polymer containing a group having a terminal double bond, in which an average value of positive electric charges (?+) of two carbonyl carbons of the imide ring is equal to or less than 0.099 as calculated by a charge equilibration method.

Abstract: A sealing resin composition including an epoxy resin, a curing agent, an inorganic filler, and rubber particles, in which a toughness index of a cured product of the sealing resin composition at 25° C. is equal to or more than 80 and equal to or less than 100.

Abstract: Provided is a microorganism that is able to produce 2-phenylethanol at a high concentration, and a method of efficiently producing 2-phenylethanol by using a saccharide as a raw material. Provided is a coryneform bacterium transformant in which a shikimate pathway is activated, and further, a gene that encodes an enzyme having phenylpyruvate decarboxylase activity is introduced in such a manner that the gene can be expressed. Also provided is a 2-phenylethanol producing method that includes causing the coryneform bacterium transformant according to the present disclosure to react in water containing a saccharide.

Abstract: A method for producing an encapsulated structure, the method including: a step of supplying granules or powder (1) formed from an epoxy resin composition to an extruder equipped with a screw (42) and a die (5) provided at the tip of the screw (42), and heating and melting the granules or powder (1) formed from the epoxy resin composition; a step of extruding the molten epoxy resin composition through the die (5) having a predetermined opening shape by rotation of the screw (42); a step of cutting the extruded epoxy resin composition (6) into a predetermined length to obtain a tablet formed from the epoxy resin composition, where the tablet has dimensions with a diameter of equal to or more than 40 mm and equal to or less than 100 mm and a length of equal to or more than 50 mm and equal to or less than 300 mm; a step of transferring the tablet to a transfer molding machine having a molding mold (30) in which an object to be encapsulated is disposed; and a step of obtaining an encapsulated structure by encap

Abstract: A lignin-modified novolac-type phenol resin having a weight average molecular weight of equal to or more than 5500.

Abstract: A heat-curable resin composition for a friction material includes a lignin-modified novolac-type phenol resin having a weight average molecular weight of equal to or more than 6,000, and a curing agent.

Abstract: The protective film 10 is used by being attached to a resin substrate 21 in a case of performing heat bending on the resin substrate while heating the resin substrate. The protective film includes a base material layer and a pressure sensitive adhesive layer which is positioned between the base material layer and the resin substrate, and is adhered to the resin substrate. The base material layer is composed of a laminate including a first layer which is positioned on a side opposite to the pressure sensitive adhesive layer and a second layer which is positioned on a side of the pressure sensitive adhesive layer. The protective film has a trouser elongation strain at break of 300% or less in a direction inclined at 45° to both MD and TD of the protective film, which is measured in accordance with JIS K 7128-1 (1998).

Abstract: An encapsulating resin composition for injection molding of the present invention includes a thermosetting resin, a curing agent, an inorganic filler, and an imidazole catalyst, in which in a DSC curve obtained in a case where a temperature is raised from 30° C. to 330° C. by using a differential scanning calorimeter under a condition of a temperature rise rate of 10° C./min, a peak temperature of a maximum exothermic peak is equal to or higher than 155° C. and lower than 175° C., and width in a half value of the maximum exothermic peak, which is obtained by adopting a straight baseline that connects a point of a minimum heat flow before the maximum exothermic peak and a point of a minimum heat flow after the maximum exothermic peak, is equal to or lower than 32° C.