Abstract: A culture vessel that can suppress foaming in a culture medium when a common nozzle is used to supply a liquid culture medium and a gas together. This culture vessel includes: a vessel body having an opening portion that communicates with a housing space; a lid that closes the opening portion; and a nozzle that passes through the and extends to the housing space, and supplies a liquid culture medium and a gas together. The nozzle has a vent opening portion that is formed so as to open in a side of the nozzle and serves as a movement path of the gas from inside of the nozzle into the housing space.

Abstract: Provided is a water soluble resol-type phenol resin, in which an unreacted phenol content is 0.1% by mass or less and an unreacted aldehyde content is 0.1% by mass or less.

Abstract: A resin molding material of the present invention contains (A) soft magnetic particles, (B) a silica fine powder having an average particle diameter of equal to or more than 0.1 ?m and equal to or less than 2.0 ?m, and (C) a thermosetting resin, in which a content of the soft magnetic particles (A) is equal to or more than 96% by mass, and a content of the silica fine powder (B) is equal to or less than 1.5% by mass.

Abstract: A resin molding material of the present invention is used for transfer molding or compression molding, the resin molding material containing (A) soft magnetic particles, (B) a silicone compound which is liquid at normal temperature (25° C.) , and (C) a thermosetting resin, in which a content of the soft magnetic particles (A) is equal to or more than 96% by mass.

Abstract: A series of palladium compounds as described herein are found to be superior vinyl addition polymerization catalysts. Specifically the compounds of formulae (I) and (II) as described herein surprisingly exhibit much higher reactivity than the compounds known in the art in the vinyl addition polymerization of a variety of cyclo-olefinic monomers, and thus polymers of very high molecular weight can be formed. Also disclosed are the formation of a variety of solid three dimensional objects, such as for example, solution extrusion of the polymer solutions formed from the vinyl addition polymerization of a variety of cyclic-olefinic monomers utilizing very low levels of palladium compounds of formulae (I) or (II) as described herein. The polymer films formed from the polymerization composition exhibit hitherto unattainable properties, for example superior transparent properties, higher thermal and mechanical properties, among other improved properties.

Abstract: A powder coating material used for a powder coating method including a step of immersing a coil end of a coil, which includes a conductor portion coated with an insulating coating and an exposed portion where the conductor portion is exposed from the insulating coating, in a fluidized chamber in which a powder coating material flows, and adhering a melt of the powder coating material to an outside of the exposed portion, the powder coating material containing a particulate thermosetting resin composition. The thermosetting resin composition contains an epoxy resin, and a curing agent.

Abstract: A power module (10) includes a power semiconductor chip (1) and a Cu circuit (3) having the power semiconductor chip (1) provided on one surface. The power module (10) includes: a sintering layer (2) joining the power semiconductor chip (1) and the Cu circuit (3) by using a sintering paste; and a heat dissipation sheet (4) provided for joining a Cu base plate (5) to the other surface of the Cu circuit (3), in which in a first laminated structure in which the power semiconductor chip (1), the sintering layer (2), the Cu circuit (3), and the heat dissipation sheet (4) are laminated, the total thermal resistance XA in the direction of lamination is equal to or less than 0.30 (K/W).

Abstract: A housing (121) having an electromagnetic shielding property includes a resin molded body (101), which is a cured product of a thermosetting resin composition, and a plating layer (103) provided on a surface of the resin molded body (101) (cured product), in which the plating layer (103) includes a Cu layer (first plating layer (105)), and a thickness of the Cu layer (first plating layer (105)) is 2 ?m or more and 30 ?m or less.

Abstract: This organ protecting member (1) is used when an opening portion (36a) is formed in an abdominal wall (30) and an intestinal tract (32) is exposed to a body surface (33) from the opening portion (36a) to temporarily construct an artificial anus (34). The organ protecting member (1) includes a movement restricting part (support string (12)) configured to restrict movement of a portion of the lifted intestinal tract (32) on which the artificial anus (34) is constructed toward an abdominal cavity (35); and a cover (11) disposed between the intestinal tract (32) and an inner wall surface (36b) of the opening portion (36a) of the abdominal wall (30).

Abstract: A method of manufacturing a sandwich panel (100) includes: a step of preparing a plurality of sheet-like prepregs (211); a step of performing a first heating and pressurization process through a release film (25) on upper and lower surfaces of a laminate where the plurality of prepregs (211) are laminated such that the laminate is integrated to obtain a composite facing material (40); and a step of disposing the composite facing material (40) on each of an upper surface side and a lower surface side of a sheet-like core layer (10) having a honeycomb structure and integrating the laminate through a second heating and pressurization process, in which a pressure of the first heating and pressurization process is higher than or equal to a pressure of the second heating and pressurization process.

Abstract: A heat radiating substrate (10) (circuit board) includes: an insulating layer (11) (insulating substrate); and a circuit pattern (20) of a metal provided on the insulating layer (11) in direct contact with the insulating layer (11), in which the circuit pattern (20) has a first circuit pattern formed in a first region on the insulating layer (11) and a second circuit pattern (120) formed in a second region on the insulating layer (11), and the first region (that is, the first circuit pattern) surrounds and closes the second region (that is, second circuit pattern (120)) when viewed in a top view.

Abstract: A heat radiating substrate includes an insulating layer (11) (insulating substrate) and a circuit pattern (20) of a metal provided on the insulating layer (11) in direct contact with the insulating layer (11), in which a contour line of the circuit pattern (20) has a corner portion (27) that forms a curved line exhibiting a circular arc with a radius of 0.2 mm or more and 5 mm or less when viewed in a top view.

Abstract: A motor (100) includes a stator (6) having a plurality of tooth portions (7), a coil (9) wound around the tooth portions (7), and a slot (8) in which the coil (9) is formed between the tooth portions (7), in which the coil (9) is provided in the slot (8), and a cooling structure for the motor (100) includes a first resin composition with which the slot (8) is filled and which covers the coil (9), and a coil inner side cooling flow path (10) which is provided in a region filled with the first resin composition and extends in a rotating shaft direction, and in which a coolant circulates inside.

Abstract: Provided is a phenol resin composition for a friction material, including a component (A) of a silicone resin having a softening point of 140° C. or lower and a component (B) of a phenol resin.

Abstract: A heat radiating substrate (10) includes an insulating layer (11) and a circuit pattern (20) of a metal formed on the insulating layer (11) in direct contact with the insulating layer (11), in which a side surface (that is, metal layer side surface (23)) of the circuit pattern (20) has a region in which an angle ? formed by a surface (insulating layer upper surface (11a)) of the insulating layer (11) (insulating substrate) and a tangential line L at a middle portion (X1) in a height direction in a cross-sectional view perpendicular to an extending direction of the metal is 80 degrees or more and 100 degrees or less.

Abstract: There is provided a thermally conductive sheet with a metal plate including: a metal plate; and a thermally conductive sheet laminated on the metal plate and containing a thermosetting resin and boron nitride particles, in which an average particle size of the boron nitride particles is 10 ?m or more and 100 ?m or less, and an amount of warpage of the thermally conductive sheet when the metal plate is removed is 0.15 mm or more and 1.30 mm or less.

Abstract: A resin composition of the present invention is used in an optical layer 10 provided with a first layer (base material layer 1) including a polycarbonate-based resin and a visible light absorber for forming the first layer. The visible light absorber includes a plurality of kinds of light absorbers, and a melting point of a first light absorber having the lowest melting point is equal to or higher than 200° C., in which a melting point of a second light absorber having the highest melting point is equal to or lower than 330° C. The resin composition is such that the viscosity at 260° C. obtainable when a shear rate is 243.2 [1/sec] is equal to or more than 400 Pa·s and equal to or less than 3500 Pa·s.

Abstract: Resin-adhered graphite particles are obtained by causing a modified novolac-type phenolic resin to adhere to graphite particles. At least part of surfaces of the graphite particles is coated with a carbonaceous coating by heating the resin-adhered graphite particles in a non-oxidizing atmosphere at 900 to 1,500° C. to carbonize the modified novolac-type phenolic resin. Arylene groups having hydroxy groups account for 5 to 95 mol % of arylene groups constituting the modified novolac-type phenolic resin. The obtained carbonaceous substance-coated graphite particles exhibit excellent battery properties when used as a negative electrode material for a lithium ion secondary battery.

Abstract: The thermosetting resin composition of the present invention includes an epoxy resin (A), a curing agent (B), and thermally conductive particles (C), in which the epoxy resin (A) includes a mesogen skeleton and has a softening point of 60° C. or lower, and a thermal conductivity ?200 of a cured product of the thermosetting resin composition at 200° C. is 12.0 W/(m·K) or higher.

Abstract: The method for manufacturing a photosensitive resin composition of the present invention is a method for manufacturing a photosensitive resin composition containing an amide bond-containing precursor having a repeating unit represented by General Formula (1), the method including a step of obtaining an activated carboxylic acid material by activating a carboxylic acid compound represented by General Formula (2) and a step of obtaining the amide bond-containing precursor by allowing an amine compound represented by General Formula (3) to act on the activated carboxylic acid material, in which at least either the step of obtaining an activated carboxylic acid material and the step of obtaining the amide bond-containing precursor is performed in a solvent containing a carbonyl group-containing heterocyclic compound.