Abstract: The present invention discloses a tape binding device winding a tape piece having an adhesive surface on one side around an electric wire bundle to bundle it. In the device, a pair of arms having a holding surface are lowered while holding the tape piece cut into a predetermined length on the holding surface. As it is lowered, free ends of both arms are lowered to both sides separated by a top portion of the electric wire bundle. At the time of lowering, after winding the tape piece by pressing it around a surface of the electric wire bundle, the free ends of both arms make adhesive surfaces of both ends of the tape piece under the electric wire bundle to adhere each other and are clipped between them, thereby laminating adhesive surfaces each other.