Abstract: A printed wiring board includes: a first insulating layer having a first main surface and a second main surface opposite to the first main surface; a first wire pattern, a second wire pattern and a first ground pattern disposed on the second main surface and extending along a first direction in a plan view; a second ground pattern disposed on the first main surface; an adhesive layer disposed on the second main surface so as to cover the first wire pattern, the second wire pattern and the first ground pattern; a second insulating layer disposed on the adhesive layer and having a third main surface facing the adhesive layer side and a fourth main surface opposite to the third main surface; a third ground pattern disposed on the fourth main surface; and a first conductor layer.

Abstract: The printed wiring board according to an embodiment of the present disclosure comprises: a substrate; a first wiring layer having a first wiring that is disposed directly or indirectly on the substrate; and a second wiring layer having a second wiring that is disposed directly or indirectly on the substrate. The average wire width of the first wiring is 40 ?m or less, and the average wire width of the second wiring is 50 ?m or more.

Abstract: A flexible printed circuit board includes a base film having an insulating property and a plurality of interconnects laminated to at least one surface side of the base film. The plurality of interconnects includes a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect being greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50. The first interconnect includes a first conductive underlayer and a first plating layer, and the second interconnect includes a second conductive underlayer, a second plating layer, and a third plating layer.

Abstract: A printed wiring board includes a base layer having insulating properties, a first conductive layer directly or indirectly stacked on the base layer front surface, and including a copper foil, a second conductive layer directly or indirectly stacked on the base layer back surface, and including a copper foil, a stacked body for a via hole, the stacked body being stacked on an inner periphery and a bottom of a connection hole that extends through the first conductive layer and the base layer in a thickness direction, and being configured to electrically connect the first conductive layer and the second conductive layer to each other, and having an electroless copper plating layer. Each copper foil contains a copper crystal grain oriented in a plane orientation, and an average crystal grain size of copper of each copper foil is 10 ?m or greater, the electroless copper plating layer includes palladium.

Abstract: A dielectric sheet includes a polytetrafluoroethylene and spherical inorganic fillers, wherein a mass ratio of the inorganic fillers to the polytetrafluoroethylene is 1.3 or more, the inorganic fillers have an average particle diameter of 0.3 ?m to 4.0 ?m, and the inorganic fillers include a silica filler. Part of the polytetrafluoroethylene is present in the form of a plurality of fibrous bodies, and in a SEM image of a surface of the dielectric sheet after a 180-degree peel test, at least part of fibrous bodies among the plurality of fibrous bodies has areas with a thickness of 0.1 ?m to 3.0 ?m and a length of 50 ?m to 5000 ?m, and an average space between the areas of the at least part of fibrous bodies is 10 ?m or less.

Abstract: A flexible printed circuit board includes an electrically conductive line, and a land connected to the electrically conductive line and to be connected to a terminal, the land including soldering portions that have metal surfaces and to which the terminal is to be soldered. The terminal includes an overlapping section that overlaps the flexible printed circuit board and a protruding section that protrudes outward from the flexible printed circuit board and is soldered to a connecting member that connects electrode portions of power storage elements.

Abstract: A printed circuit board includes a base film having a main surface, and an electrically conductive pattern disposed on the main surface. A normal line of the main surface is along a first direction. The electrically conductive pattern includes a plurality of wiring portions disposed side by side along a second direction to be spaced apart from each other, the second direction being orthogonal to the first direction. The plurality of wiring portions include a first wiring portion and a second wiring portion that are each present at a corresponding one of both ends in the second direction and a plurality of third wiring portions that are present between the first wiring portion and the second wiring portion in the second direction.

Abstract: A printed circuit board includes a base film having a main surface, and an electrically conductive pattern disposed on the main surface. The electrically conductive pattern includes an electrically conductive base layer disposed on the main surface directly or indirectly, and a copper electroplating layer disposed on the electrically conductive base layer. The void density, being a value obtained by dividing a sum of areas of voids within a predetermined observation length at an interface between the electrically conductive base layer and the copper electroplating layer by the observation length, is more than 0.01 ?m2/?m and 5.5 ?m2/?m or less.

Abstract: In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.

Abstract: A flexible printed circuit board including a terminal includes a flexible printed circuit board that includes an electrically conductive line and the terminal soldered to the flexible printed circuit board. The flexible printed circuit board includes a land and a soldering restricting section. The land is electrically connected to the electrically conductive line and has a metal surface and is soldered to the terminal. The soldering restricting section has a non-metal surface and is not soldered to the terminal. The terminal includes an overlapping section and a protrusion section. The overlapping section overlaps the land and is soldered to the land and includes a removed section that is formed in such a manner that a portion is partially removed in a predefined area. The protruding section is continuous from the overlapping section and protrudes to an area that does not overlap the flexible printed circuit board.

Abstract: A connection module includes a FPC and bus bars connected to the FPC and connecting the electrode terminals of power storage elements that are adjacent to each other. The FPC includes a first wiring portion, a second bus bar mount portion, and a third bus bar mount portion to which the bus bars are connected. The FPC further includes a second expandable/contractable portion and a third expandable/contractable portion. The second expandable/contractable portion is continuous from the second bus bar mount portion and allowed to be expanded and contracted in a direction to be closer to and farther away from the first wiring portion and the third bus bar mount portion. The third expandable/contractable portion is continuous from the third bus bar mount portion and allowed to be expanded and contracted in a direction to be closer to and farther away from the second bus bar mount portion.

Abstract: A flexible printed circuit board includes an electrically conductive line and a land that is connected to the electrically conductive line and to be connected to a terminal. The land includes soldering portions that have metal surfaces and to which the terminal is to be soldered. A dividing section is between the soldering portions and the dividing section has a non-metal surface and defines each of the soldering portions that are adjacent to each other.

Abstract: A printed wiring board according to one aspect of the present disclosure includes a substrate, and a wiring layer disposed on the substrate and having a spiral wiring line forming a planar coil. When one direction in a winding direction of the entire wiring line in plan view is defined as a positive direction, the wiring layer has a first portion for reducing a density of a current flowing in the positive direction.

Abstract: A printed wiring board includes a base film having a first major surface provided with a groove, and a wiring line disposed in the groove. The wiring line includes a metal particle layer disposed at least on a bottom surface of the groove and a plating layer disposed on the metal particle layer. The metal particle layer contains a plurality of metal particles bonded to each other by metallic bonding. A surface of each of the plurality of metal particles is partially coated with an organic film.

Abstract: A coil device includes a base film that has a first principal surface and a second principal surface; a first coil wiring line that is disposed on the first principal surface and has a spirally wound portion; a second coil wiring line that is disposed on the second principal surface and has a spirally wound portion; a first protective layer that is disposed on the first principal surface to cover the first coil wiring line; a second protective layer that is disposed on the second principal surface to cover the second coil wiring line; and an electrically conductive section. A through hole is formed in the base film. The through hole extends through the base film along a thickness direction.

Abstract: A wet treatment apparatus is configured to treat a continuously moving sheet-shaped workpiece and includes a wet treatment tank including a side surface portion having a first slit, a pair of rolls located outside the wet treatment tank, the pair of rolls being spaced apart from the first slit and being arranged in such a manner as to nip the workpiece in a transverse direction, and a pair of treatment-liquid shield members disposed on a side opposite to a side on which the wet treatment tank is disposed with the pair of rolls interposed between the pair of treatment-liquid shield members and the wet treatment tank in a movement direction of the workpiece. In a direction parallel to a width of the first slit, a width of the shield member is larger than a width of the roll.

Abstract: A coupling structure in a wiring board including a printed wiring board and a flexible printed wiring board overlaid on the printed wiring board. The printed wiring board includes a first conductive line on a surface adjacent to the flexible printed wiring board. The flexible printed wiring board includes a second conductive line on a surface on an opposite side from the printed wiring board. The flexible printed wiring board includes a conduction-purpose through hole adjacent to the second conductive line and in which a section of the first conductive line is disposed. The first conductive line of the printed wiring board and the second conductive line of the flexible wiring board are electrically connected to each other with a conductive member disposed in the conduction-purpose through hole. The conductive member is covered with a resin having an insulating property.

Abstract: A flexible printed circuit board according to an embodiment includes a base film and a first wire. The base film has a first surface. The first wire is disposed on the first surface. The first wire has a first layer and a second layer. The first layer is disposed on the first surface directly or indirectly. The second layer covers the first layer. In the first surface, a first groove is formed next to the first layer in a plan view. The second layer on a side surface of the first layer exists on a bottom surface and a side surface of the first groove.

Abstract: A flexible printed circuit board includes: a base film having a hole for forming a through hole; and a coil-shaped wiring layer layered on at least one surface side of the base film, wherein the wiring layer includes a land portion arranged at an inner peripheral surface of the hole and at a peripheral portion of the hole of the base film, and a winding portion arranged in a spiral shape with the land portion as an inside end portion or an outside end portion, wherein the winding portion includes a first winding portion that is an outermost circumference and a second winding portion that is inside relative to the outermost circumference, and wherein a ratio of an average thickness of the land portion to an average thickness of the second winding portion is 1.1 or more and 5 or less.

Abstract: A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 ?m, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.