Abstract: A metal-insulator-metal (MIM) capacitor and a process of forming the same are disclosed. The process includes steps of: forming a lower electrode that provides a lower layer and an upper layer; forming an opening in the upper layer; forming a supplemental layer on the lower layer exposed in the opening; heat treating the lower electrode and the supplemental layer; covering at least the upper layer of the lower electrode with an insulating film; and forming an upper electrode in an area on the insulating film, where the area is not overlapped with the supplemental layer and within 100 ?m at most from the supplemental layer. A feature of the MIM capacitor is that the supplemental layer is made of a same metal as a metal contained in the lower layer of the lower electrode.

Abstract: A method for manufacturing a shaped article includes a step of providing a high-speed steel powder, a step of forming a powder layer by spreading the powder, a step of forming a solidified layer in which the powder is in a bound state by irradiating the powder layer with a scanning laser beam, and a step of stacking up solidified layers by sequentially repeating the step of forming a powder layer and the step of forming a solidified layer, thereby forming the shaped article. The laser beam has an energy density of 60 J/mm3 or more and less than 600 J/mm3.

Abstract: An optical semiconductor module according to the embodiment includes: a board including a transmission line; a block including a low-permittivity material; an inductor mounted on the block, the inductor being connected with the transmission line via a first wire, the first wire having a first inductance; a semiconductor laser device mounted on the board, the semiconductor laser device being connected with the transmission line via a second wire, the second wire having a second inductance smaller than the first inductance; and a housing configured to accommodate the board, the block, the inductor, and the semiconductor laser device.

Abstract: Provided is a proton conductor that achieves an improvement in transport number while suppressing a decrease in conductivity. The proton conductor contains a metal oxide having a perovskite structure and represented by formula (1): AaB1-x-yB?xMyO3-? (1), wherein an element A is at least one element selected from the group consisting of Ba, Sr, and Ca, an element B is at least one element selected from the group consisting of Zr and Ce, an element B? is Hf, an element M is at least one element selected from the group consisting of Y, Yb, Er, Ho, Tm, Gd, In, and Sc, ? is an oxygen deficiency amount, and “a”, “x”, and “y” satisfy 0.9?a?1.0, 0.1?y?0.2, and 0<x(1?y)?0.2.

Abstract: An armrest described herein includes an arm-side wire harness including an electric wire and an arm-side connector that is on an end of the electric wire and is to be coupled to a seat-side connector mounted on a seat. The armrest further includes an arm body member including an electric wire routing cavity in which the electric wire of the arm-side wire harness is arranged and a seat-side wall that is to be arranged opposite a seat frame of the seat. The arm body member is to be fixed to the seat frame while the seat-side wall being opposite the seat frame. The seat-side wall includes a connector insertion hole through which the arm-side connector can be inserted. The arm body member includes an operation hole that is continuous from the connector insertion hole via an arrangement section of the electric wire routing cavity.

Abstract: An optical connector cable including an optical cable, a first resin member, and a second resin member is disclosed. The optical cable includes a plurality of optical fibers and a sheath surrounding the plurality of optical fibers. End portions of the plurality of optical fibers extend to the outside from an end surface of the sheath. The first resin member holds the end portions of the plurality of optical fibers extending to the outside from the end surface of the sheath. The second resin member covers at least a part of the first resin member and an end portion of the sheath.

Abstract: In the direction from the first main surface toward the second main surface through each of the second impurity region and the fourth impurity region, a concentration profile of an n-type impurity has a second relative maximum value and a fourth relative maximum value located closer to the first main surface than a position where the second relative maximum value is exhibited. The fourth relative maximum value is larger than the third relative maximum value, the third relative maximum value is larger than the second relative maximum value, and the second relative maximum value is larger than the first relative maximum value.

Abstract: A heater includes a base having a first surface and a second surface, and a heat generator disposed on a third surface of the base, the third surface being parallel to the first surface. The base includes a hole portion that opens in at least the second surface. The third surface includes a plurality of blank areas on each of which the heat generator is not present and each of which is circular. The blank areas include a first blank area including a region that the hole portion overlaps and a second blank area that does not include a region that the hole portion overlaps.

Abstract: An optical semiconductor module according to an embodiment includes a housing; a temperature control element having a temperature control plane; a first board mounted on the temperature control plane; a semiconductor laser device mounted on the second side of the first board; a second board mounted on the second side of the first board, the second board having a third side and a fourth side, the fourth side including a wiring pattern, the wiring pattern being electrically connected with the housing via a first bonding wire and electrically connected to the semiconductor laser device via a second bonding wire, the second board having a second thermal conductivity smaller than the first thermal conductivity. The housing is configured to accommodate the temperature control element, the first board, the second board, and the semiconductor laser device.

Abstract: A variable gain amplifier circuit includes first and second input terminals, first and second output terminals, first and second transistors respectively having bases electrically connected to the first and second input terminals and having collectors electrically connected to the first and second output terminals, and a degeneration circuit connected between emitters of the first and second transistors. The degeneration circuit has first and second MOS transistors each having two current terminals connected in series between the emitters of the first and second transistors, series resistor circuits, first and second current sources, two resistive elements connected between the first and second current sources and gates of the first and second MOS transistors, and two resistive elements connected between the first and second current sources and two nodes of the series resistor circuits.

Abstract: A microwave circuit integrated on a common semiconductor substrate, includes: a first-stage amplifier to amplify an input high-frequency signal having a first frequency; a main-system amplification stage to amplify and output one signal having the first frequency branched from an output of the first-stage amplifier; a branch stage to generate a signal having double the frequency of the first frequency; and a sub-system amplification stage to amplify and output the signal having double the frequency. An amplification circuit constituting the first-stage amplifier, an amplification circuit included in the branch stage, an amplification circuit included in the main-system amplification stage, and an amplification circuit included in the sub-system amplification stage are connected in series between a power supply and ground in a DC manner, and each is a current reuse type amplifier including two-stage transistors connected in series between a signal input and a signal output in an AC manner.

Abstract: A tungsten carbide powder 1 includes bonded bodies 10 each including a plurality of tungsten carbide crystal grains 11, in which the bonded bodies 10 include, at a grain boundary 11a between the plurality of tungsten carbide crystal grains 11, a chromium-concentrated region 12 which has a chromium concentration higher than that in the tungsten carbide crystal grains 11.

Abstract: An amplitude modulation circuit includes: first, second, and third input terminals; first and second output terminals; a current source; first and second transistors including a base electrically connected to the first and second input terminals, a collector electrically connected to the first and second output terminals, and an emitter electrically connected to a grounding terminal via the current source; first and second resistive elements electrically connected between the first and second output terminals and a power line; and a first MOS transistor including a drain connected to the first output terminal, a source connected to the second output terminal, and a gate connected to the third input terminal. The MOS transistor is configured to operate in a non-saturated region, and a resistance between the source and the drain of the MOS transistor is larger than resistances of the first and second resistive elements.

Abstract: A communication assistance system according to one aspect of the present disclosure assists communication between a first user corresponding to a first terminal and a second user corresponding to a second terminal. The communication assistance system includes at least one processor. The at least one processor receives video data representing the first user from the first terminal, analyzes the video data and selects a movement pattern corresponding to a non-verbal behavior of the first user from a movement pattern group of an avatar, and transmits control data indicating the selected movement pattern to the second terminal such that an avatar corresponding to the first user in a virtual space displayed on the second terminal is moved based on the selected movement pattern.

Abstract: An armrest includes a bracket fixed to a frame of a seat, an armrest body member rotatably mounted on the bracket, a receiver coil mounted in the armrest body member, and a transmitter coil mounted in the bracket and transferring power to the receiver coil with a non-contact transmission system.

Abstract: An optical connection component includes optical fibers; one or a plurality of line members arranged in parallel with the optical fibers, line members having a lower elastic limit and being easier to undergo plastic deformation at room temperature than the optical fibers; a first securing member as a block having a plurality of capillaries extending parallel to one another or as a combination of a V-grooved board and a flat board, the V-grooved board having a plurality of V-grooves extending parallel to one another, the first securing member securing one-end portions of the optical fibers and one-end portions of the one or plurality of line members individually in the plurality of capillaries or in the plurality of V-grooves; and a second securing member that secures the optical fibers and the one or plurality of line members on a side near other-end portions of the one or plurality of line members.

Abstract: Provided is a method for manufacturing a sintered component, which can suppress occurrence of edge chipping when a through-hole is formed in a powder-compact green body and also has a good productivity. The method for manufacturing a sintered component includes a molding step of press-molding a raw material powder containing a metal powder and thus fabricating a powder-compact green body; a drilling step of forming a hole in the powder-compact green body using a drill; a sintering step of sintering the powder-compact green body after drilling, wherein the drill used for drilling has a circular-arc shaped cutting edge on a point portion thereof.

Abstract: A wire cover disclosed by this specification is for covering a plurality of wires pulled out from a housing, and includes a cover body into which the plurality of wires pulled out from the housing are introduced from front and from which the plurality of wires are drawn out in a rightward direction, and a guiding portion provided on an inner surface of the cover body and configured to guide small-diameter wires arranged to have shorter in-cover lengths, out of the plurality of wires, than a large-diameter wire on a left side arranged to have a longest in-cover length from a wire introduction position PI where the wire is introduced into the cover body to a wire draw-out position PO where the wire is drawn out from the cover body, out of the plurality of wires to an extra length accommodation space provided in the cover body.

Abstract: An optical fiber holder for holding an optical fiber includes: a holder main body; and a groove part that is capable of holding a part of the held optical fiber. The optical fiber holder has an adjustment mechanism that is capable of adjusting a position of the groove part with respect to the holder main body in a state where the groove part is placed on the holder main body.

Abstract: A wire harness routing apparatus disclosed by the present specification is a wire harness routing apparatus (10) that is to be attached to a rotation platform (80) that allows a seat (S) to be rotated with respect to a base portion (90) provided in a vehicle, the wire harness routing apparatus (10) including a wire harness (20) that is arranged between the seat (S) and the base portion (90), and a case (40) that rotates accompanying the rotation of the seat (S) in a state of accommodating the wire harness (20), wherein the case (40) is arranged on the inner side in the radial direction of the rotation platform (80) using the rotation axis of the rotation platform (80) as a reference.