Abstract: Disclosed herein are a refractory repairing material for repairing a brick comprising a mixture of 70 to 80 wt % of alumina having not more than 1 mm of grain size, which comprises 25 to 30 wt % of the above amount with a grain size not passing through a 325 mesh and 45 to 50 wt % of the above amount with a grain size passing through a 325 mesh; 1 to 7 wt % of carbonaceous material having a grain size passing through a 60 mesh; 1 to 5 wt % of magnesia having a grain size passing through a 325 mesh; and 10 to 25 wt % of aluminum phosphate, and a method of repairing a plate-like brick.
Type:
Grant
Filed:
August 30, 1990
Date of Patent:
July 30, 1991
Assignees:
Toshiba Ceramics Co., Ltd., Sumitomo Metal Indus., Ltd.