Patents Assigned to Summit Imaging, Inc.
  • Patent number: 11537405
    Abstract: A computer-implemented tool for use with an medical device having a computer system, the tool including an unsecured software-implemented suite of diagnostic tools and utilities configured to read logs, read system configuration provide a Telnet function, eject USB, and deactivate itself, and a secured software-implemented suite of diagnostic tools and utilities configured to interpret a key file received from an external source, upload the tool into the computer system of the medical device, run the tool upon booting up of the computer system to enable a replacement component in the medical device to be activated after installation in the medical device.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: December 27, 2022
    Assignee: Summit Imaging, Inc.
    Inventors: Lawrence R. Nguyen, James B. Taylor
  • Patent number: 11269653
    Abstract: A computer-implemented tool for use with an medical device having a computer system, the tool including an unsecured software-implemented suite of diagnostic tools and utilities configured to read logs, read system configuration provide a Telnet function, eject USB, and deactivate itself, and a secured software-implemented suite of diagnostic tools and utilities configured to interpret a key file received from an external source, upload the tool into the computer system of the medical device, run the tool upon booting up of the computer system to enable a replacement component in the medical device to be activated after installation in the medical device.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: March 8, 2022
    Assignee: Summit Imaging, Inc.
    Inventors: Lawrence R. Nguyen, James B. Taylor
  • Patent number: 10552170
    Abstract: A computer-implemented tool for use with an medical device having a computer system, the tool including an unsecured software-implemented suite of diagnostic tools and utilities configured to read logs, read system configuration provide a Telnet function, eject USB, and deactivate itself, and a secured software-implemented suite of diagnostic tools and utilities configured to interpret a key file received from an external source, upload the tool into the computer system of the medical device, run the tool upon booting up of the computer system to enable a replacement component in the medical device to be activated after installation in the medical device.
    Type: Grant
    Filed: April 12, 2016
    Date of Patent: February 4, 2020
    Assignee: Summit Imaging, Inc.
    Inventors: Lawrence R. Nguyen, James B. Taylor
  • Publication number: 20140253673
    Abstract: A device for converting a video signal from one DVI format to another is provided, the device having an input module configured to convert a first DVI video signal to an HDMI video signal, a converter configured to convert the HDMI video signal to a VGA video signal, and an output module configured to convert the VGA video signal to a second DVI video signal. A medical teleconferencing system is also provided, the system having a video imaging device that outputs a video signal in a first DVI format, a video conferencing system configured to receive a video signal in a second DVI format, and a conversion device configured to receive the video signal in the first DVI format, convert the video signal in the first DVI format to a HDMI video signal, convert the HDMI video signal to a VGA video signal, and convert the VGA video signal to a video signal in the second DVI format for output to the video conferencing system.
    Type: Application
    Filed: March 5, 2014
    Publication date: September 11, 2014
    Applicant: Summit Imaging, Inc.
    Inventor: Stephenjon Besagar Barredo
  • Publication number: 20140252073
    Abstract: A device for providing a reliable and robust electrical connection of a chip to a board using a plurality of solder balls, the device including a non-rigid body formed of a thermal resistant material having a top side and a bottom side, the bottom side having an adhesive layer; and an array of openings formed in the body, the array of openings arranged in a pattern that matches a pattern of conductive pads on the board, each opening having a circular plan form shape that is sized to enable a single solder ball to be slideably received in the opening, each opening spaced from adjacent openings by a distance that prevents adjacent solder balls from electrically connecting to each other when the solder balls are subjected to a temperature sufficient to reflow the solder ball.
    Type: Application
    Filed: March 5, 2014
    Publication date: September 11, 2014
    Applicant: Summit Imaging, Inc.
    Inventor: Stephenjon Besagar Barredo