Patents Assigned to Sun Microsystems Limited
  • Patent number: 6124778
    Abstract: A magnetic component assembly includes a circuit board having at least one layer. A first winding is provided on at least one surface of a layer of the circuit board and a further winding is provided on the same or a different surface of the circuit board. A first magnetic core is associated with the first winding to define a first magnetic component and a further magnetic core is associated with the further winding to define a further magnetic component. There is thereby provided an assembly of two or more magnetic components integrated in a single circuit board providing an efficient space saving configuration. A particular application relates to the provision of integrated magnetic components for power supplies.
    Type: Grant
    Filed: October 14, 1997
    Date of Patent: September 26, 2000
    Assignees: Sun Microsystems, Inc., Sun Microsystems Limited
    Inventors: Anna K. Rowley, Robert G. Murton, Donald E. Walker