Abstract: The present invention provides a solid-state imaging device comprising: a transparent substrate transmitting light therethrough; a first chip including a solid-state imaging element having a light receiving portion; a first resin providing airtight sealing between the first chip and the transparent substrate; a second chip opposite to the transparent substrate with respect to the first chip; and second resin die bonding the second chip to the first chip, wherein the first resin and the second resin are made of the same material.