Patents Assigned to SUNASIC TECHNOLOGIES, INC.
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Patent number: 11659288Abstract: An image sensing device that can adjust parameters of an image before sending it to a processor for reducing computing power and/or storage requirement is disclosed. The image sensing device includes an array of sensing pixels; an output amplifier; an analog-to-digital converter; a first set of registers and a second set of registers; an activation circuit; and a profiling logic. The profiling logic conducts statistical analysis on output data and adjusts parameters stored in the first set of registers until results of the statistical analysis reaches a target standard, wherein the adjusted parameters are used to generate an output image by each sensing pixel of the array of sensing pixels once the target standard is reached and a notification signal is sent to an external device for notifying the failure of parameter adjustment if the target standard fails to be reached within a predetermined times of adjustment.Type: GrantFiled: October 22, 2020Date of Patent: May 23, 2023Assignee: SunASIC Technologies, Inc.Inventors: Chi-Chou Lin, Zheng-Ping He
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Patent number: 11187721Abstract: An electronic device having a structure that electrically connects the contactor to an electronic device during a testing process is disclosed. The contactor includes a holder for accommodating the electronic device during the testing process; a flexible circuit, having a first set of contacts electrically connected to the corresponding electrode terminals of the electronic device, and a second set of contacts electrically connected to a control unit that sends test signals during the test process; an elastomer, for adjusting the pressure between the first set of contacts of the flexible circuit and the corresponding electrode terminals of the electronic device while being pressed together; and an alignment tool, for aligning the first set of contacts with the corresponding electrode terminals of the electronic device. The electrode terminals of the electronic device are located on the same surface of the electronic device and the flexible circuit is detachable from the contactor.Type: GrantFiled: February 3, 2020Date of Patent: November 30, 2021Assignee: SunASIC Technologies, Inc.Inventors: Chi-Chou Lin, Hsien-Hsueh Lee, Zheng-Ping He
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Patent number: 10963546Abstract: A biometric security device for digital key storing is disclosed. The biometric security device includes a biometric information fetching module and a processing module. The processing module has a nonvolatile storage unit and a processing unit. The nonvolatile storage unit includes a secure storage unit and a general storage unit. The biometric security device with a secure electronic key designed for storing secret data utilizes both TrustZoneā¢ technology (or similar technology) and biometric authentication. Thus, it can provide the flexibility for multiple users or applications to use the biometric security device or any equipment the biometric security device mounted in without compromising the safeguard of the data stored therein.Type: GrantFiled: April 9, 2018Date of Patent: March 30, 2021Assignee: SunASIC Technologies, Inc.Inventors: Chi Chou Lin, Zheng Ping He
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Patent number: 10578575Abstract: A noise-reduced capacitive sensing unit is disclosed. The noise-reduced capacitive sensing unit includes: a sensing plate; a first bias voltage source for providing a first bias voltage; a second bias voltage source for providing a second bias voltage; a switch unit, connected between two bias voltage sources and the sensing plate, for selectively providing one of the bias voltages to the sensing plate; an excitation signal source for providing a bi-level waveform; a reference capacitor, formed between the excitation signal source and the sensing plate, for injecting the excitation signal to the sensing plate; and a voltage follower for providing sensing results, wherein an input node of the voltage follower is connected to the sensing plate.Type: GrantFiled: September 13, 2017Date of Patent: March 3, 2020Assignee: SunASIC Technologies, Inc.Inventors: Chi-Chou Lin, Zheng-Ping He
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Patent number: 10452565Abstract: A secure electronic device is disclosed. The secure electronic device includes a first core processing unit, a secure boot Read-Only Memory, a first non-volatile memory, a first volatile memory and a first communication interface. A new framework based on the secure electronic device with built-in security is able to safeguard intellectual property for the developers and further improves the security of the secure electronic device. Thus, more developers can launch their programs or services without being stolen or tampered by an unauthorized party.Type: GrantFiled: January 12, 2018Date of Patent: October 22, 2019Assignee: SUNASIC TECHNOLOGIES, INC.Inventors: Chi Chou Lin, Hao-Jyh Liu, Zheng Ping He
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Patent number: 10168450Abstract: A silicon wafer having colored top side is disclosed in the present invention. The silicon wafer includes: a wafer; a first semi-conductor layer, formed on at least a portion of a top side of the wafer, having periodical structures to form a grating pattern, and a second semi-conductor layer, formed on the first semi-conductor layer with a bottom side substantially fully contacted with the periodical structures. The first semi-conductor layer and the second semi-conductor layer form a photonic crystal layer and work to reflect a predetermined wavelength range of incident visible light beams. The present invention provides a silicon wafer which can reflect specified color(s) from the surface facing external light beams. Therefore, dies from cutting the silicon wafer with functions to interact with external environment rather than packaged can have advantages to show some specified logo or trademark.Type: GrantFiled: December 27, 2013Date of Patent: January 1, 2019Assignee: Sunasic Technologies, Inc.Inventors: Chi-Chou Lin, Zheng-Ping He
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Patent number: 10162995Abstract: A capacitive image sensor with noise reduction feature and a method operating the capacitive image sensor are provided. The capacitive image sensor includes: a number of capacitive sensing units forming an array, each capacitive sensing unit for transforming a distance between a portion of a surface of an approaching finger and a top surface thereof into an output electric potential, wherein a value of the output electric potential is changed by a driving signal coupled on the finger; at least one sample-and-hold circuit for capturing and retaining different output electric potentials; at least one signal conditioning circuit, each comprising: at least one differential amplifier for amplifying a difference between two electric potentials retained by the sample-and-hold circuit; and a driving source, for providing the driving signal to the finger.Type: GrantFiled: April 17, 2017Date of Patent: December 25, 2018Assignee: SUNASIC TECHNOLOGIES, INC.Inventors: Chi Chou Lin, Zheng Ping He
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Patent number: 10146986Abstract: A capacitive image sensor and a method for operating the capacitive image sensor are provided. The capacitive image sensor has an array of capacitive sensing units for transforming a distance between each of the capacitive sensing units and a surface of an adjacent finger into an output electric potential. The capacitive sensing unit comprises: a protective layer; a first sensing plate, formed under the protective layer; a second sensing plate, formed under the first sensing plate; an active semiconductor circuitry, formed under the second sensing plate and connected to the first and second sensing plates; at least one first insulating layer, formed between the first sensing plate and the second sensing plate; and at least one second insulating layer, formed between the second sensing plate and the active semiconductor circuitry.Type: GrantFiled: July 28, 2017Date of Patent: December 4, 2018Assignee: SUNASIC TECHNOLOGIES, INC.Inventors: Chi Chou Lin, Zheng Ping He
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Patent number: 10133905Abstract: A capacitive fingerprint sensing unit and enhanced capacitive fingerprint reader using the capacitive fingerprint sensing units are disclosed. The enhanced capacitive fingerprint reader includes a number of capacitive fingerprint sensing units, forming a fingerprint sensing array; a conductive element; and an excitation signal driver, for providing excitation signals to the conductive element. By increasing the thicknesses of a first inter-metal dielectric layer and a second inter-metal dielectric layer in fingerprint sensing units in the enhanced capacitive fingerprint reader, sensitivity of the enhanced capacitive fingerprint reader can be improved.Type: GrantFiled: December 4, 2015Date of Patent: November 20, 2018Assignee: SunASIC Technologies, Inc.Inventors: Chi-Chou Lin, Zheng-Ping He
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Patent number: 10121043Abstract: A printed circuit board assembly (PCBA) and a method to assemble the PCBA are disclosed. The PCBA includes a printed circuit board (PCB), an image sensing chip and a protection layer. The PCB includes a first insulation layer, a second insulation layer, a first electrically conductive layer, a second electrically conductive layer, and a third electrically conductive layer. The image sensing chip has a number of bonding pads with a sensor portion facing down through the second opening. The PCBA can function as an image sensing module and make the module have the thinnest thickness.Type: GrantFiled: November 18, 2014Date of Patent: November 6, 2018Assignee: Sunasic Technologies, Inc.Inventors: Chi-Chou Lin, Zheng-Ping He
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Publication number: 20180300520Abstract: A capacitive image sensor with noise reduction feature and a method operating the capacitive image sensor are provided. The capacitive image sensor includes: a number of capacitive sensing units forming an array, each capacitive sensing unit for transforming a distance between a portion of a surface of an approaching finger and a top surface thereof into an output electric potential, wherein a value of the output electric potential is changed by a driving signal coupled on the finger; at least one sample-and-hold circuit for capturing and retaining different output electric potentials; at least one signal conditioning circuit, each comprising: at least one differential amplifier for amplifying a difference between two electric potentials retained by the sample-and-hold circuit; and a driving source, for providing the driving signal to the finger.Type: ApplicationFiled: April 17, 2017Publication date: October 18, 2018Applicant: SunASIC Technologies, Inc.Inventors: Chi Chou LIN, Zheng Ping HE
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Patent number: 10078776Abstract: A capacitive fingerprint sensor which includes capacitive sensing units is disclosed. Each of the capacitive sensing unit includes a sensing electrode; a first switch; a voltage follower; and a reference capacitor. The voltage follower includes an adjustable current source, for providing at least two distinct current levels; and a MOS transistor. The MOS transistor includes a source node, connected to ground via the adjustable current source and serves as an output node of the voltage follower; a gate node, connected to the sensing electrode and serves as an input node of the voltage follower; a drain node, connected to a power source, for providing power to the voltage follower; and a bulk node, connected to the source node.Type: GrantFiled: December 16, 2016Date of Patent: September 18, 2018Assignee: SunASIC Technologies Inc.Inventors: Chi Chou Lin, Zheng Ping He
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Patent number: 10068936Abstract: A Printed Circuit Board Assembly (PCBA) for forming an enhanced biometric module and a method for manufacturing the PCBA are disclosed. The method includes the steps of providing a PCB, a biometric sensing chip and SMDs; mounting the biometric sensing chip on the PCB with each bonding pad being electrically linked to one corresponding first contact pad; mounting the SMDs on second contact pads which are electrically linked thereto, respectively; and forming a protection layer. The present invention takes advantages of compact size of small conductive elements to avoid cracks in the protection layer.Type: GrantFiled: November 16, 2015Date of Patent: September 4, 2018Assignee: SunASIC Technologies, Inc.Inventors: Chung Hao Hsieh, Chi Chou Lin, Zheng Ping He
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Patent number: 10042947Abstract: A read-only method and a read-only system for operating a portable device are disclosed. The system includes a portable device which has a memory unit and a processing unit, and a host which has a display unit and a processor. A browser requests an access to a portable device inserted to a host. After the storage units been accessed are traced, corresponding service will be performed by the portable device without being blocked by the security system of the host.Type: GrantFiled: October 30, 2014Date of Patent: August 7, 2018Assignee: Sunasic Technologies, Inc.Inventor: Chi-Chou Lin
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Patent number: 10037954Abstract: A chip with I/O pads on the peripheries and a method making the chip is disclosed. The chip includes: a substrate; a first metal layer, formed above the substrate; an inter-metal dielectric layer, formed above the first metal layer, having concave portions formed along the peripheries of the chip so that a portion of the first metal layer is exposed to form an input-output (I/O) pad in each of the concave portions which are spaced apart from each other; and a passivation layer, formed above the second metal layer without covering the concave portions so that specific circuits are formed by the first metal layer and the second metal layer, respectively. By changing the I/O pad from the top of the chip to the peripheries, the extra thickness of the packaged chip caused by wire bonding in the prior arts can be reduced.Type: GrantFiled: March 16, 2017Date of Patent: July 31, 2018Assignee: Sunasic Technologies, Inc.Inventors: Chi Chou Lin, Zheng Ping He
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Publication number: 20180173919Abstract: A capacitive fingerprint sensor which includes capacitive sensing units is disclosed. Each of the capacitive sensing unit includes a sensing electrode; a first switch; a voltage follower; and a reference capacitor. The voltage follower includes an adjustable current source, for providing at least two distinct current levels; and a MOS transistor. The MOS transistor includes a source node, connected to ground via the adjustable current source and serves as an output node of the voltage follower; a gate node, connected to the sensing electrode and serves as an input node of the voltage follower; a drain node, connected to a power source, for providing power to the voltage follower; and a bulk node, connected to the source node.Type: ApplicationFiled: December 16, 2016Publication date: June 21, 2018Applicant: SunASIC Technologies, Inc.Inventors: Chi Chou LIN, Zheng Ping HE
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Publication number: 20180102330Abstract: A chip package having ESD protection and a method for making the chip are disclosed. The chip package includes a chip and a substrate. The chip includes a number of I/O pads each connected to a corresponding I/O contact via a first bonding wire. It also includes a number of ESD protective pads each connected to a corresponding ESD contact via a second bonding wire. Bonding wires connecting the ESD protective pads and the ESD contacts have vertexes closer to the top surface of the chip than the vertexes of the bonding wires connecting the I/O pads and the I/O contacts. Hence, a perfect ESD protection effect is achieved by leading the ESD through the bonding wires to the ESD contacts rather than via the I/O contacts.Type: ApplicationFiled: October 12, 2016Publication date: April 12, 2018Applicant: SunASIC Technologies, Inc.Inventors: Chung-Hao HSIEH, Chi-Chou LIN, Zheng-Ping HE
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Publication number: 20180074004Abstract: A noise-reduced capacitive sensing unit is disclosed. The noise-reduced capacitive sensing unit includes: a sensing plate; a first bias voltage source for providing a first bias voltage; a second bias voltage source for providing a second bias voltage; a switch unit, connected between two bias voltage sources and the sensing plate, for selectively providing one of the bias voltages to the sensing plate; an excitation signal source for providing a bi-level waveform; a reference capacitor, formed between the excitation signal source and the sensing plate, for injecting the excitation signal to the sensing plate; and a voltage follower for providing sensing results, wherein an input node of the voltage follower is connected to the sensing plate.Type: ApplicationFiled: September 13, 2017Publication date: March 15, 2018Applicant: SunASIC Technologies, Inc.Inventors: Chi-Chou LIN, Zheng-Ping HE
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Patent number: 9907178Abstract: A printed circuit board having an electronic component embedded is disclosed. The printed circuit board has four electrically conductive layers and three core layers formed interleavedly. By properly removing a portion of the printed circuit board, the electronic component can be exposed. It has advantages that the exposed electronic component can be a CCD, CMOS or module. When the devices mentioned are embedded in the printed circuit board, one part of them can be exposed from the printed circuit board for normal functions. The overall thickness of the printed circuit board assembly can be minimized to meet the trend of compact design of electronic products.Type: GrantFiled: February 2, 2016Date of Patent: February 27, 2018Assignee: Sunasic Technologies, Inc.Inventor: Chi-Chou Lin
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Patent number: 9836636Abstract: A capacitive image sensor and a method for running the capacitive image sensor are disclosed. The capacitive image sensor includes a number of capacitive sensing elements, forming an array, each capacitive sensing element for transforming a distance between a portion of a surface of an approaching finger and a top surface thereof into an output voltage, wherein a value of the output voltage is changed by a driving signal exerted on the finger; an A/D converter, for converting the output voltage into a number and outputting the number; and a signal source, for providing the driving signal to the finger.Type: GrantFiled: June 22, 2016Date of Patent: December 5, 2017Assignee: Sunasic Technologies Inc.Inventors: Chi-Chou Lin, Zheng-Ping He