Abstract: The present disclosure is directed to embodiments of a utensil, such as a spoon, having an integrated heat transfer reservoir that can facilitate transfer of heat from or to an external environment, such as a liquid (e.g., soup, hot cocoa), to cool or warm the temperature of that external environment. The utensil can include a handle and a head. The head can be coupled to the handle. The head comprises a heat transfer reservoir. A top piece of the head and a bottom piece of the head can be configured to mate together to define a void within the head. The void has a volume and at least a portion of the volume of the void can be filled with a heat transfer material configured to absorb and store heat.