Abstract: A substrate support apparatus reduces sagging of a substrate. The substrate support apparatus includes a plurality of position adjusters arranged in parallel and spaced apart with respect to a first direction; and a plurality of supports connected to the plurality of position adjusters and configured to support a substrate, wherein the plurality of supports are spaced apart from each other under the substrate and are configured to support the substrate, and wherein the plurality of supports are configured to be raised by the plurality of position adjusters.

Abstract: The present invention relates to an OLED pixel compensation circuit for removing a substrate effect. The pixel compensation circuit according to the present invention uses six transistors and two storage batteries to fix both a source voltage and a body voltage of a driving transistor that drives an OLED, thereby having the effects of eliminating errors due to a substrate effect and presenting more accurate pixel compensation results.

Abstract: The present invention relates to an OLED pixel compensation circuit for removing a substrate effect. The pixel compensation circuit according to the present invention uses six transistors and two storage batteries to fix both a source voltage and a body voltage of a driving transistor that drives an OLED, thereby having the effects of eliminating errors due to a substrate effect and presenting more accurate pixel compensation results.

Abstract: An apparatus for depositing an organic material includes: a main chamber; a first substrate loading section in which a first substrate is loaded in the first radial direction and seated; a second substrate loading section in which a second substrate is loaded in the second radial direction and seated; a scanner including a linear organic material deposition source, a source moving means to which the organic material deposition source is coupled to linearly move the organic material deposition source so that the organic material particles are injected onto the surface of the first substrate or the second substrate, and a rotating means for rotating the source moving means; and a scanner moving means for moving the scanner back and forth so that the scanner is positioned in the first deposition region or the second deposition region.

Abstract: The present invention relates to a thin film deposition apparatus, which includes: a deposition chamber supporting a substrate therein; a plurality of crucibles keeping a deposition material to be deposited on the substrate; a distribution conduits coupled to the crucibles, respectively, and arranged in a line to spray an evaporated deposition material through a plurality of nozzles; a separator disposed between the distribution conduits for uniformity of a thin film deposited on the substrate and limiting a spray range of the evaporated deposition material; distribution conduit heaters independently installed and facing outer sides of the distribution conduits to heat the distribution conduits; crucible heaters heating the crucibles to evaporate the deposition material; and a top plate having an exit port corresponding to the nozzles and disposed over the distribution conduits.

Abstract: The present invention relates to a thin film deposition apparatus, which includes: a deposition chamber supporting a substrate therein; a plurality of crucibles keeping a deposition material to be deposited on the substrate; a distribution conduit having a plurality of coupling holes axially arranged to communicate with the crucibles, and spraying the deposition material evaporated from the crucibles through a plurality of nozzles formed through a top thereof; distribution conduit heaters independently installed and facing an outer side of the distribution conduit to heat the distribution conduit; crucible heaters heating the crucibles to evaporate the deposition material; and a top plate having an exit port corresponding to the nozzles and disposed over the distribution conduit. Accordingly, it is possible to reduce the height of the chamber by decreasing the height of the crucibles and to perform symmetric or asymmetric deposition by independently performing left/right deposition on a substrate.

Abstract: Disclosed is a method and an apparatus for coating electromagnetic wave shielding films, by which adhesive forces between coating objects and the electromagnetic wave shielding films are strengthened, and the films can be uniformly coated on the coating objects. In the method, surfaces of coating objects are etched, and then electromagnetic wave shielding films are coated on the surfaces of the coating objects. In the apparatus, a cylindrical rotating jig is disposed in a chamber and contains a plurality of coating objects loaded therein. The rotating jig is rotated at a predetermined speed. The rotating jig is put into and drawn out of the chamber. Targets functioning as cathodes are disposed inside and outside of the rotating jig. A controller controls operation of the apparatus.