Abstract: Disclosed is a modular housing for drivers used for LED lamps. The housing includes connectors for AC in from a power source, DC out to the lamps, and also has connectors allowing for control lines to be received from a control box. The housing includes an arrangement for creating two opposite stacks of drivers. The fronts of the drivers are cooled by circulating air through the space between the stacks, and heat is also dissipated through the side walls of the housing, which acts as a heat sink. The number and specifications of the drivers in the housing are configured such that every module is able to serve a number of LED lamps.

Abstract: Ultra violet light-emitting diode (hereafter UV LED) curing units containing one or X array or XY arrays of UV LED modules with integrated optical, mechanical, and heat dissipation systems, and one, or X array, or XY arrays of extrusions with integrated air or liquid cooling systems to receive and house the integrated UV LED. The UV LED modules may be any size or shape depending on the power requirements of a given curing application. The LED chips or the groups of LED chips used for the above UV LED modules may be in other wavelengths for other applications. The UV LED modules have excellent heat dissipation because the LED chips or groups of LED chips are directly mounted on metal extrusion. The LED modules also have a single optical lens system between the LED chips and the surrounding ambient air.

Abstract: Embodiments of the present disclosure include a bidirectional analog switch having a pair of high-voltage transistors coupled together via a common source and gate. The switches are configured to effectively isolate an input terminal from an output terminal by passing leakage and feedthrough to a power supply. In certain embodiments, an off-state pinned switch pins the common source voltage to a power source voltage. A logic circuit receives an input logic signal and generates two non-overlapped output logic signals for controlling the pair of transistors and the off-state pinned switch. In other embodiments, a resistor pins the common source voltage to a power supply voltage for passing leakage and feedthrough to the power supply.

Abstract: LED downlight and other point source luminaires contain one or more Application-Specific LED modules with integrated optical, mechanical, and heat dissipation systems; a fluted extruded metal housing acts as a heat sink as well as the luminaire housing containing the AS-LED module(s) or receiving a rotatable spherical housing that contains the AS-LED module, printed circuit board units, and wires; mounting brackets; and a remote LED driver. The extruded aluminum housing (and heat sink) may be comprised of a single cylinder or multiple concentric cylinders. The heat dissipation base of the AS-LED module can be any shape and size dependent on the type of LED luminaire the AS-LED module is designed for. The LED luminaires have a short thermal path, including just one electrical/thermal insulation layer between the LED chips and the housing, and one optical lens system between the LED chips and the surrounding ambient air.

Abstract: LED downlight and other point source luminaires contain one or more Application-Specific LED modules with integrated optical, mechanical, and heat dissipation systems; a fluted extruded metal housing acts as a heat sink as well as the luminaire housing containing the AS-LED module(s) or receiving a rotatable spherical housing that contains the AS-LED module, printed circuit board units, and wires; mounting brackets; and a remote LED driver. The extruded aluminum housing (and heat sink) may be comprised of a single cylinder or multiple concentric cylinders. The heat dissipation base of the AS-LED module can be any shape and size dependent on the type of LED luminaire the AS-LED module is designed for. The LED luminaires have a short thermal path, including just one electrical/thermal insulation layer between the LED chips and the housing, and one optical lens system between the LED chips and the surrounding ambient air.