Patents Assigned to SUNPREME
  • Method for forming copper metallization over TCO of solar cells
    Patent number: 9876135
    Abstract: Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high conductivity and relatively low cost copper is used. Methods for enabling the use of copper as busbar and fingers over a TCO are disclosed, providing good adhesion while preventing migration of the copper into the TCO. Also, provisions are made for easy soldering contacts to the copper busbars.
    Type: Grant
    Filed: February 11, 2017
    Date of Patent: January 23, 2018
    Assignee: SUNPREME
    Inventors: Ashok Sinha K., Roman Milter, Robert Broesler