Abstract: Compositions and methods for creating in situ capacitors, micro-capacitors, battery like applications, and chipless memory chips are provided. The methods and compositions all comprise the use of magnetically-alignable particles. In various applications herein the particles may be nonconductive, in another aspect, the particles are conductive. The functional capacitors entail the ferromagnetic particles and a dielectric material or a non-conductive coating.
Abstract: Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.
Abstract: Compositions for thermal interface materials comprising magnetically-alignable, thermally-conductive, electrically-nonconductive particles in a matrix comprising curable polymers are provided. The compositions are also useful for use as heat sinks. Methods are provided for the use of such compounds for thermal management and heat dissipation in the electronics industry.
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