Patents Assigned to Sunric Co., Ltd
  • Patent number: 7732012
    Abstract: Provided is a method for the preparation of polycrystalline silicon in which, in conducting preparation of polycrystalline silicon by the Siemens method or by the monosilane method, no outer heating means is necessitated for the core member (seed rod), onto which polycrystalline silicon is deposited, from the initial stage of heating, the deposition rate is high and the core member seed rod can be used repeatedly. The method for deposition of high-purity polycrystalline silicon, at a high temperature, onto a white-heated seed rod in a closed reaction furnace by pyrolysis or hydrogen reduction of a starting silane gas supplied thereto, is characterized in that the seed rod is a member made from an alloy having a recrystallization temperature of 1200° C. or higher. It is preferable that the alloy member is of an alloy of Re—W, W—Ta, Zr—Nb, titanium-zirconium, or a carbon-added molybdenum (TZM) in the form of a wire member having a diameter of at least 0.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: June 8, 2010
    Assignees: Shin-Etsu Film Co., Ltd, Sunric Co., Ltd
    Inventors: Tatsuhiko Hongu, Yasuhiro Kato, Hiroshi Hagimoto