Abstract: A method for manufacturing an electronic device casing having a coupling structure is provided. The electronic device casing is made of a casing material including a supportive substrate and a first thermoplastic substrate. A preliminary connecting section is formed on the first thermoplastic substrate by a hot-pressing molding process, and a molding plastic material is injected onto the preliminary connecting section by an in-mold injection process. After being cooled, the molding plastic material engages with the preliminary connecting section to form a secondary connecting section for a coupling element to couple with. Thus, the coupling structure of the electronic device casing can be directly formed during a manufacturing process without any additional procedures, thereby overall manufacturing time and costs are reduced.

Abstract: A method for manufacturing an electronic device casing having a coupling structure is provided. The electronic device casing is made of a casing material including a supportive substrate and a first thermoplastic substrate. A preliminary connecting section is formed on the first thermoplastic substrate by a hot-pressing molding process, and a molding plastic material is injected onto the preliminary connecting section by an in-mold injection process. After being cooled, the molding plastic material engages with the preliminary connecting section to form a secondary connecting section for a coupling element to couple with. Thus, the coupling structure of the electronic device casing can be directly formed during a manufacturing process without any additional procedures, thereby overall manufacturing time and costs are reduced.

Abstract: An industrial product structure combined with organic material is formed in an injection mold which has a mold cavity and at least one injection port to allow an injection material to be injected into the mold cavity. The industrial product formed in the mold includes an organic material layer on the surface, a bottom layer having at least one orifice and an injection material layer located between the organic material layer and bottom layer. The organic material layer and bottom layer are placed in advance in the mold cavity with the orifice of the bottom layer positioned above the injection port of the mold cavity. The injection material is injected through the injection port and orifice to form the injection material layer. The injection material layer has two sides bonded to the organic material layer and bottom layer.

Abstract: A finished product structure formed by In-mold decoration process includes an electromagnetic protective material, a bearing layer and a formed plastic material. The electromagnetic protective material includes a metal film, a structure reinforced layer and an electromagnetic isolation layer. The structure reinforced layer is located between the metal film and electromagnetic isolation layer to enhance physical strength of the electromagnetic protective material. The bearing layer includes an adhesive surface laid with an adhesive layer and a bearing surface. The adhesive surface faces the electromagnetic protective material. The electromagnetic protective material and bearing layer are disposed in a mold, and plastic material is injected onto the bearing surface through a plastic material runner to form the formed plastic material. The formed plastic material includes a first surface bonded to the bearing surface and a second surface on another side opposite to the first surface.