Abstract: A plating apparatus used in a diamond plating process in which a first electrode having a surface from which plating material is released is located in connection with a firing electrode to generate a first arc, the first arc being used to start a second arc between the first electrode and a second electrode, and in which apparatus a plasma spray formed from plating material released from the first electrode is directed toward a substrate to be plated includes a grinding element in contact with the surface of the first electrode and a mechanism for rotating the surface of the first electrode. The grinding element may be a firing electrode or an abrading tool. A method of operating the plating apparatus includes abrading the surface of the first electrode from which plating material is released.