Patents Assigned to Supercon, Inc.
  • Patent number: 4734827
    Abstract: A tantalum lead wire for capacitors having improved grain growth characteristics is disclosed. The lead preferably comprises a Niobium core having a surface consisting of many discrete layers of Tantalum surrounding the Niobium.
    Type: Grant
    Filed: April 7, 1987
    Date of Patent: March 29, 1988
    Assignee: Supercon, Inc.
    Inventor: James Wong
  • Patent number: 4674009
    Abstract: A tantalum lead wire for capacitors having improved grain growth characteristics is disclosed. The lead preferably comprises a Niobium core having a surface consisting of many discrete layers of tantalum surrounding the Niobium.
    Type: Grant
    Filed: April 14, 1986
    Date of Patent: June 16, 1987
    Assignee: Supercon, Inc.
    Inventor: James Wong
  • Patent number: 4646197
    Abstract: A tantalum lead wire for capacitors having improved grain growth characteristics is disclosed. The lead preferably comprises a Niobium core having a surface consisting of many discrete layers of Tantalum surrounding the Niobium.
    Type: Grant
    Filed: December 23, 1985
    Date of Patent: February 24, 1987
    Assignee: Supercon, Inc.
    Inventor: James Wong
  • Patent number: 3930903
    Abstract: A stable, high field, high current conductor is produced by packing multiple, multi-layer rods of a bronze core and niobium or vanadium inner jacket and copper outer jacket into a pure copper tube or other means for forming a pure copper matrix, sealing, working the packed tube to a wire, and by diffusion, heat treating to form a type II superconducting, Beta-Wolfram structure, intermetallic compound as a layer within each of several filaments derived from the rods. The layer of Beta-Wolfram structure compound may be formed in less than 2 hours of diffusion heat treatment in a thickness of 0.5-2 microns.
    Type: Grant
    Filed: February 7, 1974
    Date of Patent: January 6, 1976
    Assignee: Supercon, Inc.
    Inventors: Robert N. Randall, James Wong