Patents Assigned to Surtech Company Limited
  • Method of high speed plating
    Patent number: 4726884
    Abstract: Disclosed is a method of high-speed plating which comprises carrying out plating of a substrate, for example, a through-hole wiring substrate, which is under being parallelly rotated in a plane including the surface of the substrate simultaneously with being vibrated in up-and-down direction and/or in right and left direction at predetermined angle with the rotating direction.
    Type: Grant
    Filed: February 24, 1987
    Date of Patent: February 23, 1988
    Assignee: Surtech Company Limited
    Inventor: Hironari Sawa