Abstract: A device and a process for producing a corrugated plate having a plurality of bent-into-contact portions extending in parallel on one face of a metal plate employs a number of steps. A first pressing step sequentially molds a plurality of U-shaped bent portions in the metal plate. A second pressing step sequentially molds the bent-into-contact portions by sequentially crushing the plurality of U-shaped bent portions. In the first pressing step, the U-shaped bent portions are fed in a direction orthogonal to the direction of the U-shaped bent portions, and positioned, and are pressed in a state in which the position is released. In the second pressing step, another face of the metal plate is pressed flat while molding the bent-into-contact portions by pressing the U-shaped bent portions from both sides.

Abstract: A semiconductor device inspecting apparatus includes a chamber, a stage situated in the chamber for placing a semiconductor device thereon, a femtosecond laser apparatus, and an electron microscope. The femtosecond laser apparatus includes a laser generating section for generating laser beams disposed outside the chamber, and a laser optical system for introducing the laser beams generated at the laser generating section into the chamber. The laser generating section generates femtosecond width pulse and a strength so that the semiconductor device on the stage is cut by the laser beams introduced inside the chamber. The electron microscope is disposed inside the chamber for observing the semiconductor device cut by the laser beams.

Abstract: The present invention provides a semiconductor device inspecting apparatus capable of generating a sharp cut cross section. The semiconductor device inspecting apparatus 1 comprises a stage 141 disposed in a vacuum chamber 11 in which a semiconductor device (sample S) is set, a femtosecond laser apparatus 12 for generating femtosecond laser beams FSLB which cut the semiconductor device, and an electron microscope (SEM 17) which observes a cut surface W of the semiconductor device which was cut by the laser beams.

Abstract: An apparatus according to the invention is for treating waste materials of foam resin products having been used mainly as packing or wrapping materials, which is provided with a crushing room furnishing stationary cutting edges and rotatably moving cutting edges at the lower part of a hopper into which the waste foam resin materials are thrown, and at the outside of the crushing room, a cylindrical volume shrinking mechanism which receives the destroyed resin products and send them in succession, heats to soften and fuse them one another, and effecting heat and pressure thereto so as to de-foam and extrude the resin like a hot chewing cake or a hot birdlime. The cylindrical volume shrinking mechanism has an extruding nozzle opening upward, from which the resin is charged into a metal mold cylinder and when this charging amount reaches to a certain level, the operation of the cylindrical volume shrinking mechanism is stopped.

Abstract: The present invention relates to an apparatus for shrinking volumes of waste foamed plastics which have been used as packing materials. The waste plastic materials are thrown into a hopper provided on a crushing room having an opening in an upper part and tapering towards its lower part. A plurality of crushing vanes having a radius of gyration of length reaching within said hopper rotate in said crushing room, to break the foamed plastics into shreds. The broken plastics flow into a sending cylinder through a receipt opening toward the side wall of the crushing room, and are sent forward by screw vanes within the sending cylinder. Subsequently, the waste plastics are compressed in a compression cylinder connected in series to the sending cylinder and further softened and de-foamed by a heating cylinder and exhausted through a nozzle provided at the end of the housing cylinder. Extruded bar like shrinked resins are cut into chips by a rotating cutter and exhausted from the apparatus by air flow.