Abstract: In a method and an apparatus for measuring temperature-controlled electronic components in a test station, a component to be measured is held and positioned using a chuck, has a temperature-controlled and directed fluid flow applied to it and is electrically contact-connected using probes and is measured. The setting of the temperature of the component to the temperature at which the measurement is intended to be carried out is effected solely using a directed fluid flow at a defined temperature.
Type:
Grant
Filed:
August 16, 2007
Date of Patent:
March 2, 2010
Assignee:
SUSS MicroTec Tech Systems GmbH
Inventors:
Carel van de Beek, Stefan Kreissig, Volker Hansel, Sebastian Giessmann, Frank-Michael Werner, Claus Dietrich, Jorg Kiesewetter