Patents Assigned to Susumu Co., Ltd.
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Patent number: 5642148Abstract: A thermal head apparatus includes a heat generation driving integrated circuit and a current detecting integrated circuit. The heat generation driving integrated circuit is constituted by a plurality of first switching elements respectively connected in series with current detecting resistors, a first shift register for serially inputting print input data for heating heat generation elements, a first latch circuit for latching the print input data input to the first shift register at a predetermined timing, and a first output gate circuit for selectively controlling energization of the first switching elements on the basis of the print input data latched by the first latch circuit.Type: GrantFiled: November 29, 1994Date of Patent: June 24, 1997Assignees: NEC Corporation, Susumu Co., Ltd.Inventors: Itaru Fukushima, Takashi Okamoto
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Patent number: 5499442Abstract: A delay line device having first and second substrates. The first substrate has a signal line centrally formed on one of main surfaces of a ceramic substrate, bonding electrodes formed in a peripheral portion of the main surface and a ground electrode formed over substantially the entire region of the other main surface thereof. The second substrate has bonding electrodes formed on one of main surfaces of the ceramic substrate identical in thickness and material to the ceramic substrate and a ground electrode formed over substantially the entire region of the other main surface thereof. The delay line device is formed by superimposing the first and second substrates on one another so that the bonding electrodes of the first substrate face those of the second substrate and bonding the bonding electrodes of both substrates to one another. Such delay line devices can be manufactured using mother substrates and mother dummy substrates.Type: GrantFiled: July 7, 1994Date of Patent: March 19, 1996Assignee: Susumu Co., Ltd.Inventors: Nakaba Nakamura, Makoto Kosaki
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Patent number: 5422662Abstract: A thermal printer head comprises an array of heating elements (1-1.about.1-N) mounted on an insulating base member (20). Each of the heating elements is connected to a common voltage source (V) and has a temperature dependent electrical resistance. Electrically resistive elements (2-1.about.2-N) are respectively connected in series with the heating elements to form a plurality of series circuits. Current supply circuits (3-1.about.3-N, 4-1.about.4-N, 5, 6, 7-1.about.7-N, 14) are provided corresponding respectively to the resistive elements for selectively supplying a current to the series circuits in response to a sequence of print signals. A control circuit (8-11, 14) makes a determination whether a voltage developed across each resistive element is higher or lower than a prescribed threshold value and causes one of the current supply ciruits corresponding to the resistive element to control the current depending on the determination.Type: GrantFiled: March 25, 1993Date of Patent: June 6, 1995Assignees: NEC Corporation, Susumu Co., Ltd.Inventors: Itaru Fukushima, Nakaba Nakamura, Takashi Okamoto
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Patent number: 5365203Abstract: A delay line device comprises first and second substrates. The first substrate has a signal line centrally formed on one of main surfaces of a ceramic substrate, bonding electrodes formed in a peripheral portion of the main surface and a ground electrode formed over substantially the entire region of the other main surface thereof. The second substrate has bonding electrodes formed on one of main surfaces of a ceramic substrate identical in thickness and material to the above ceramic substrate and a ground electrode formed over substantially the entire region of the other main surface thereof. The delay line device is formed by superimposing the first and second substrates on one another so that the bonding electrodes of the first substrate face those of the second substrate and bonding the bonding electrodes of both substrates to one another. Such delay line devices can be manufactured using mother substrates and mother dummy substrates.Type: GrantFiled: October 25, 1993Date of Patent: November 15, 1994Assignee: Susumu Co., Ltd.Inventors: Nakaba Nakamura, Makoto Kosaki
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Patent number: 5254838Abstract: An igniter for electric ignition systems is made up of intergrally formed terminals and heating elements of metal thin film. Therefore, it maintains its stable ignition performance, high safety, and high reliability over a long period of time even in a severe environment. The heating element is covered with a protective coating film made of an inorganic material to ensure good heat conduction and to maintain the initial performance over a long period of time.Type: GrantFiled: March 9, 1992Date of Patent: October 19, 1993Assignees: Nippon Koki Co., Ltd., Susumu Co., Ltd.Inventors: Hitoshi Hasegawa, Hirokazu Kobari, Junichi Kishimoto, Nakaba Nakamura, Akihito Tamura
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Patent number: 5227231Abstract: An electrical resistive material used for making e.g. a heating element for a thermal printing element. It is a Cr--Al--B--Zr--O alloy and is composed of a quaternary alloy and 15 to 25 at % of oxygen, wherein the quaternary alloy is composed of 2 to 25 at % of zirconium and a ternary alloy containing 35 to 55 at % of chromium, 2 to 23 at % of aluminium and 37 to 58 at % of boron.Type: GrantFiled: January 3, 1992Date of Patent: July 13, 1993Assignee: Susumu Co., Ltd.Inventors: Sadao Yoshizaki, Kazuya Nishimura, Masami Kawabayashi