Patents Assigned to Susumu Co., Ltd.
  • Patent number: 5642148
    Abstract: A thermal head apparatus includes a heat generation driving integrated circuit and a current detecting integrated circuit. The heat generation driving integrated circuit is constituted by a plurality of first switching elements respectively connected in series with current detecting resistors, a first shift register for serially inputting print input data for heating heat generation elements, a first latch circuit for latching the print input data input to the first shift register at a predetermined timing, and a first output gate circuit for selectively controlling energization of the first switching elements on the basis of the print input data latched by the first latch circuit.
    Type: Grant
    Filed: November 29, 1994
    Date of Patent: June 24, 1997
    Assignees: NEC Corporation, Susumu Co., Ltd.
    Inventors: Itaru Fukushima, Takashi Okamoto
  • Patent number: 5499442
    Abstract: A delay line device having first and second substrates. The first substrate has a signal line centrally formed on one of main surfaces of a ceramic substrate, bonding electrodes formed in a peripheral portion of the main surface and a ground electrode formed over substantially the entire region of the other main surface thereof. The second substrate has bonding electrodes formed on one of main surfaces of the ceramic substrate identical in thickness and material to the ceramic substrate and a ground electrode formed over substantially the entire region of the other main surface thereof. The delay line device is formed by superimposing the first and second substrates on one another so that the bonding electrodes of the first substrate face those of the second substrate and bonding the bonding electrodes of both substrates to one another. Such delay line devices can be manufactured using mother substrates and mother dummy substrates.
    Type: Grant
    Filed: July 7, 1994
    Date of Patent: March 19, 1996
    Assignee: Susumu Co., Ltd.
    Inventors: Nakaba Nakamura, Makoto Kosaki
  • Patent number: 5422662
    Abstract: A thermal printer head comprises an array of heating elements (1-1.about.1-N) mounted on an insulating base member (20). Each of the heating elements is connected to a common voltage source (V) and has a temperature dependent electrical resistance. Electrically resistive elements (2-1.about.2-N) are respectively connected in series with the heating elements to form a plurality of series circuits. Current supply circuits (3-1.about.3-N, 4-1.about.4-N, 5, 6, 7-1.about.7-N, 14) are provided corresponding respectively to the resistive elements for selectively supplying a current to the series circuits in response to a sequence of print signals. A control circuit (8-11, 14) makes a determination whether a voltage developed across each resistive element is higher or lower than a prescribed threshold value and causes one of the current supply ciruits corresponding to the resistive element to control the current depending on the determination.
    Type: Grant
    Filed: March 25, 1993
    Date of Patent: June 6, 1995
    Assignees: NEC Corporation, Susumu Co., Ltd.
    Inventors: Itaru Fukushima, Nakaba Nakamura, Takashi Okamoto
  • Patent number: 5365203
    Abstract: A delay line device comprises first and second substrates. The first substrate has a signal line centrally formed on one of main surfaces of a ceramic substrate, bonding electrodes formed in a peripheral portion of the main surface and a ground electrode formed over substantially the entire region of the other main surface thereof. The second substrate has bonding electrodes formed on one of main surfaces of a ceramic substrate identical in thickness and material to the above ceramic substrate and a ground electrode formed over substantially the entire region of the other main surface thereof. The delay line device is formed by superimposing the first and second substrates on one another so that the bonding electrodes of the first substrate face those of the second substrate and bonding the bonding electrodes of both substrates to one another. Such delay line devices can be manufactured using mother substrates and mother dummy substrates.
    Type: Grant
    Filed: October 25, 1993
    Date of Patent: November 15, 1994
    Assignee: Susumu Co., Ltd.
    Inventors: Nakaba Nakamura, Makoto Kosaki
  • Patent number: 5254838
    Abstract: An igniter for electric ignition systems is made up of intergrally formed terminals and heating elements of metal thin film. Therefore, it maintains its stable ignition performance, high safety, and high reliability over a long period of time even in a severe environment. The heating element is covered with a protective coating film made of an inorganic material to ensure good heat conduction and to maintain the initial performance over a long period of time.
    Type: Grant
    Filed: March 9, 1992
    Date of Patent: October 19, 1993
    Assignees: Nippon Koki Co., Ltd., Susumu Co., Ltd.
    Inventors: Hitoshi Hasegawa, Hirokazu Kobari, Junichi Kishimoto, Nakaba Nakamura, Akihito Tamura
  • Patent number: 5227231
    Abstract: An electrical resistive material used for making e.g. a heating element for a thermal printing element. It is a Cr--Al--B--Zr--O alloy and is composed of a quaternary alloy and 15 to 25 at % of oxygen, wherein the quaternary alloy is composed of 2 to 25 at % of zirconium and a ternary alloy containing 35 to 55 at % of chromium, 2 to 23 at % of aluminium and 37 to 58 at % of boron.
    Type: Grant
    Filed: January 3, 1992
    Date of Patent: July 13, 1993
    Assignee: Susumu Co., Ltd.
    Inventors: Sadao Yoshizaki, Kazuya Nishimura, Masami Kawabayashi