Abstract: The present invention relates to a semiconductor package and a method for forming a semiconductor package. A lead frame adapted to a semiconductor package includes a first carrier, an adjacent second carrier, a first array of leads, and a second array of leads. The first array and the second array of leads are configured to be connected to circuits located at the first and second carriers at respective near sides of the arrays. The first array of leads and the second array of leads are connected through connecting ribs, and a groove is provided on exposed surfaces. After the connecting rib is removed, a part of the groove still remains. The remaining part of the groove is exposed in a separate die package, and in a surface-mount procedure, molten solder achieves wetting more easily along the groove to make surface mounting more secure.

Abstract: The present invention relates to a semiconductor package and a method for forming a semiconductor package. A lead frame adapted to a semiconductor package includes a first carrier, an adjacent second carrier, a first array of leads, and a second array of leads. The first array and the second array of leads are configured to be connected to circuits located at the first and second carriers at respective near sides of the arrays. The first array of leads and the second array of leads are connected through connecting ribs, and a groove is provided on exposed surfaces. After the connecting rib is removed, a part of the groove still remains. The to remaining part of the groove is exposed in a separate die package, and in a surface-mount procedure, molten solder achieves wetting more easily along the groove to make surface mounting more secure.