Patents Assigned to Suzhou Industrial Park Tony Lighting Technology Co., Ltd.
  • Light-emitting diode chip package body and packaging method thereof
    Patent number: 7989817
    Abstract: AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: August 2, 2011
    Assignee: Suzhou Industrial Park Tony Lighting Technology Co., Ltd.
    Inventor: Yu-Nung Shen
  • Light-emitting diode chip package body and packaging method thereof
    Patent number: 7943403
    Abstract: AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: May 17, 2011
    Assignee: Suzhou Industrial Park Tony Lighting Technology Co., Ltd.
    Inventor: Yu-Nung Shen
  • Light-emitting diode chip package body and packaging method thereof
    Patent number: 7897984
    Abstract: AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: March 1, 2011
    Assignee: Suzhou Industrial Park Tony Lighting Technology Co., Ltd.
    Inventor: Yu-Nung Shen
  • Light-emitting diode chip package body and packaging method thereof
    Patent number: 7838895
    Abstract: AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: November 23, 2010
    Assignee: Suzhou Industrial Park Tony Lighting Technology Co., Ltd.
    Inventor: Yu-Nung Shen