Abstract: A piezoelectric printhead includes a piezoelectric printing device, a manifold, a U-shaped flexible printed wiring element and an interconnection element. The piezoelectric printing device includes a piezoelectric plate and a substrate with at least one row of drop ejectors; first and second ink inlet ports; signal lines leading to corresponding signal input pads; and ground traces leading to at least one ground return pad. The manifold is fluidically connected to the ink inlet ports. The flexible printed wiring element includes a device connection region and a pair of legs that extend from the device connection region. The pair of legs includes signal connection lines and at least one ground connection line. The interconnection element is disposed between the device connection region of the flexible printing wiring element and a contact layer of the piezoelectric printing device that includes the signal input pads and the at least one ground return pad.

Abstract: A piezoelectric printing device includes a piezoelectric plate and a substrate with at least one row of drop ejectors. Each drop ejector includes a pressure chamber on a first side of the substrate and a nozzle on a second side of the substrate. The piezoelectric plate is attached to the substrate by a bonding layer. A first electrode layer is disposed on a first surface of the piezoelectric plate that is proximate to the first side of the substrate. The first electrode layer includes signal lines and ground traces corresponding to each pressure chamber. A second electrode layer including signal input pads and ground return pads is disposed on the first side of the substrate. Signal lines and ground traces in the first electrode layer are electrically connected to signal input pads and ground return pad(s) respectively on the second electrode layer through solder joints.

Abstract: A piezoelectric printing device includes a substrate and a piezoelectric plate. At least one row of drop ejectors is disposed along a row direction. Each drop ejector includes a nozzle in fluid communication with a pressure chamber that is bounded by side walls. The piezoelectric plate has a first surface that is disposed proximate to the first side of the substrate. A bonding layer is disposed between the piezoelectric plate and the substrate. An electrode layer is disposed between the first surface of the piezoelectric plate and the bonding layer. The electrode layer includes a signal line corresponding to each pressure chamber. Each signal line leads to a signal input pad. The electrode layer also includes ground traces disposed on both sides of each pressure chamber. The ground traces are electrically connected to at least one common ground bus that is electrically connected to at least one ground return pad.

Abstract: A piezoelectric printhead includes a piezoelectric printing device, a manifold, a U-shaped flexible printed wiring element and an interconnection element. The piezoelectric printing device includes a piezoelectric plate and a substrate with at least one row of drop ejectors; an ink inlet port; signal lines leading to corresponding signal input pads; and ground traces leading to at least one ground return pad. The manifold is fluidically connected to the ink inlet port. The U-shaped flexible printed wiring element includes a device connection region and a pair of legs that extend from the device connection region. The pair of legs includes signal connection lines and at least one ground connection line. The interconnection element is disposed between the device connection region of the U-shaped flexible printing wiring element and a contact layer of the piezoelectric printing device that includes the signal input pads and the at least one ground return pad.

Abstract: A piezoelectric printing device includes a piezoelectric plate and a substrate with at least one row of drop ejectors. Each drop ejector includes a pressure chamber on a first side of the substrate and a nozzle on a second side of the substrate. The piezoelectric plate is attached to the substrate by a bonding layer. A first electrode layer is disposed on a first surface of the piezoelectric plate proximate to the first side of the substrate. The first electrode layer includes signal lines and ground traces corresponding to each pressure chamber. A second electrode layer including signal input pads and ground return pads is disposed on an outer second side of the piezoelectric plate. Signal lines and ground traces in the first electrode layer are electrically connected to signal input pads and ground return pads respectively on the second electrode layer through conductive vias.