Patents Assigned to Suzhou Shinhao Materials LLC
  • Patent number: 11802345
    Abstract: A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10?6-100×10?6 K?1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10?6-100×10?6 K?1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10?6-1000×10?6 K?1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: October 31, 2023
    Assignee: SUZHOU SHINHAO MATERIALS LLC
    Inventors: Yun Zhang, Jing Wang, Peipei Dong, Xingxing Zhang
  • Patent number: 11613824
    Abstract: An electroplating copper layer includes bamboo-like copper crystal particles having a highly preferred orientation. The bamboo-like copper crystal particles have a long axis direction and a short axis direction, and the bamboo-like copper crystal particles have a length of 20 nm to 5 ?m in the long axis direction and a length of 20 nm to 2 ?m in the short axis direction. The bamboo-like copper crystal particles have a uniform particle size, and the electroplating copper layer has a major diffraction peak at a 2? angle of about 44°.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: March 28, 2023
    Assignee: SUZHOU SHINHAO MATERIALS LLC
    Inventors: Yun Zhang, Jing Wang, Zifang Zhu, Tao Ma, Luming Chen
  • Patent number: 11242607
    Abstract: A metal material having thermodynamic anisotropy has an X-axis hardness of 160-180 HV, an X-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K?1; a Y-axis hardness of 160-180 HV, a Y-axis hardness thermal expansion coefficient of 5×10-6-100×10-6 K?1; and a Z-axis hardness of 180-250 HV, a Z-axis hardness thermal expansion coefficient of 50×10-6-1000×10-6 K?1. A method for preparing a metal material having thermodynamic anisotropy is also disclosed.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: February 8, 2022
    Assignee: SUZHOU SHINHAO MATERIALS LLC
    Inventors: Yun Zhang, Jing Wang, Peipei Dong, Xingxing Zhang
  • Patent number: 10604857
    Abstract: An electroplating copper layer includes bamboo-like copper crystal particles having a highly preferred orientation. The bamboo-like copper crystal particles have a long axis direction and a short axis direction, and the bamboo-like copper crystal particles have a length of 20 nm to 5 ?m in the long axis direction and a length of 20 nm to 2 ?m in the short axis direction. A method of preparing the bamboo-like copper crystal particles is also disclosed.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: March 31, 2020
    Assignee: Suzhou Shinhao Materials LLC
    Inventors: Yun Zhang, Jing Wang, Zifang Zhu, Tao Ma, Luming Chen
  • Patent number: 9920023
    Abstract: The present disclosure relates to a leveling composition for electrodepositing metals.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: March 20, 2018
    Assignee: Suzhou Shinhao Materials LLC
    Inventors: Yun Zhang, Tao Ma, Peipei Dong