Abstract: A jig 20 that is installed on a device for measuring dimensions of a workpiece 10 based on images obtained by taking pictures of the workpiece 10 with a camera K includes a chuck mechanism 50 holding the workpiece K, a first rotation drive mechanism 80 that rotates the chuck mechanism 50 around a predetermined first rotation axis A, a first base 30 holding the first rotation drive mechanism 80, a second rotation drive mechanism 40 that rotates the first base 30 around a second rotation axis B orthogonal to the first rotation axis A, and a second base 21 holding the second rotation drive mechanism 40. The first base 30 has an opening 31A in the area around the first rotation axis A such that the workpiece 10 held by the chuck mechanism 50 is seen from the back of the first base 30 through the opening 31A.

Abstract: A jig 20 that is installed on a device for measuring dimensions of a workpiece 10 based on images obtained by taking pictures of the workpiece 10 with a camera K includes a chuck mechanism 50 holding the workpiece K, a first rotation drive mechanism 80 that rotates the chuck mechanism 50 around a predetermined first rotation axis A, a first base 30 holding the first rotation drive mechanism 80, a second rotation drive mechanism 40 that rotates the first base 30 around a second rotation axis B orthogonal to the first rotation axis A, and a second base 21 holding the second rotation drive mechanism 40. The first base 30 has an opening 31A in the area around the first rotation axis A such that the workpiece 10 held by the chuck mechanism 50 is seen from the back of the first base 30 through the opening 31A.

Abstract: A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole in the resin sheet and inserting the punched conductive metal chip in the through hole of the resin sheet whereby the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet, and if a large number of such substrates are laminated, electrical connection in the thickness direction can readily be made by virtue of the protruded conductive metal chips and a multi-layer board can be readily produced.

Abstract: A 2-metal layer TAB and a both-sided CSP.BGA tape having an insulating substrate and a wiring layer provided on at least both sides of the substrate, the substrate having evenly spaced sprocket holes on both width direction edges in the longitudinal direction thereof and also having through-holes formed with a punching press, and the through-holes being filled with a conductor by means of a punching press such that the conductor and the wiring layers are electrically connected, which is characterized by having round pilot holes between the sprocket holes formed in the longitudinal direction thereof; and a process of producing the same.