Patents Assigned to Swan-Lite Manufacturing Co., Ltd.
  • Patent number: 8283842
    Abstract: An object is to provide a lighting apparatus the cost of which is low, which is excellent in terms of heat dissipation capacity, and which does not make a human get burned even in the case where the human directly touches the lighting apparatus. An LED substrate unit (1) is mounted on a metal heat conduction plate (3) with high heat conductivity. Resin heat radiation plates (4, 5) with high thermal emittance and low heat conductivity are adhered to the entire exposure surface of both surfaces of the heat conduction plate (3) except for a portion on which the LED substrate unit (1) is mounted. Thus, a three layer structure is formed of the heat conduction plate and the heat radiation plates provided on both surfaces of the heat conduction plate. Heat discharged from the LED substrate unit (1) is diffused in the heat conduction plate (3) and transmitted to the resin heat radiation plates (4, 5), and the transmitted heat is discharged from the resin heat radiation plates (4, 5) to outer air.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: October 9, 2012
    Assignee: Swan-Lite Manufacturing Co., Ltd.
    Inventor: Hideyuki Kurosawa
  • Publication number: 20110163649
    Abstract: An object is to provide a lighting apparatus the cost of which is low, which is excellent in terms of heat dissipation capacity, and which does not make a human get burned even in the case where the human directly touches the lighting apparatus. An LED substrate unit (1) is mounted on a metal heat conduction plate (3) with high heat conductivity. Resin heat radiation plates (4, 5) with high thermal emittance and low heat conductivity are adhered to the entire exposure surface of both surfaces of the heat conduction plate (3) except for a portion on which the LED substrate unit (1) is mounted. Thus, a three layer structure is formed of the heat conduction plate and the heat radiation plates provided on both surfaces of the heat conduction plate. Heat discharged from the LED substrate unit (1) is diffused in the heat conduction plate (3) and transmitted to the resin heat radiation plates (4, 5), and the transmitted heat is discharged from the resin heat radiation plates (4, 5) to outer air.
    Type: Application
    Filed: June 10, 2008
    Publication date: July 7, 2011
    Applicant: Swan-Lite Manufacturing Co., Ltd.
    Inventor: Hideyuki Kurosawa