Abstract: One embodiment of the present invention discloses a process for reducing water content in wood material. The process includes the steps of: feeding the wood material into an overheated vapour filled, oxygen free drying apparatus; indirectly overheating the vapour in the drying apparatus by heating devices, whereby water and other chemical substances vaporise from the wood material into the atmosphere within the drying apparatus; releasing surplus drying apparatus vapour into separation devices which are connected to the drying apparatus; and discharging the dried wood material from the drying apparatus when the moisture content in the wood material has reached a level of less than 10% by weight. One embodiment of the present invention also discloses wood material drying devices to be used in the process.