Abstract: A lightweight electromagnetic wave shielding tape is disclosed. The tape includes a first polymer protective layer, a calendered conductive material layer coupled to a bottom side of the first polymer protective layer, and a second polymer protective layer coupled to a bottom side of the conductive material layer so that the conductive material layer is encapsulated within the protective layers. An adhesive layer can also be applied to one of the protective layers.
Type:
Grant
Filed:
July 5, 2019
Date of Patent:
June 4, 2024
Assignee:
Swift Textile Metalizing LLC
Inventors:
Bryan T. Wyrebek, Alexander T. Smith, Jared D G Butlin
Abstract: A composite structure is provided that includes a polymer layer and an auxetic material layer disposed within or partially within the polymer layer. The auxetic material layer provides increased conductivity and elastomeric reinforcement to the polymer layer.
Abstract: An electromagnetic wave shielding wallpaper is described. The wallpaper includes a conductive layer having a base material and a conductive material, and an adhesive layer. The wallpaper may include a protective layer disposed on a first side of the conductive layer, a fire retardant layer disposed on a second side of the conductive layer, and the adhesive layer disposed on the fire retardant layer.
Type:
Grant
Filed:
May 18, 2020
Date of Patent:
August 9, 2022
Assignee:
SWIFT TEXTILE METALIZING LLC
Inventors:
Bryan T. Wyrebek, Alexander T. Smith, Jared D G Butlin
Abstract: An electromagnetic wave shielding wallpaper is described. The wallpaper includes a conductive layer having a base material and a conductive material, and an adhesive layer. The wallpaper may include a protective layer disposed on a first side of the conductive layer, a fire retardant layer disposed on a second side of the conductive layer, and the adhesive layer disposed on the fire retardant layer.
Type:
Grant
Filed:
August 3, 2018
Date of Patent:
March 23, 2021
Assignee:
SWIFT TEXTILE METALIZING LLC
Inventors:
Bryan T. Wyrebek, Alexander T. Smith, Jared D G Butlin