Abstract: The invention relates to a method for adhesion of a thin film or functional layer to a substrate by applying a pulsed and/or alternating voltage.
Type:
Grant
Filed:
April 20, 2020
Date of Patent:
September 24, 2024
Assignee:
SY&SE SA
Inventors:
Florian Telmont, Sébastien Brun, Thierry Aellen, Sophie Farine, Herbert Keppner
Abstract: The invention relates to an anodic bonding method for bonding two elements with an intermediate layer. The invention especially, but not exclusively, relates to an anodic bonding method for between a metallic element and a heterogeneous element, for example a glass, artificial sapphire or ceramic element. The specificity and aim of the present invention is to produce an assembly that is gas-tight and fluid-tight, solderless, brazing- or welder-free and without organic compound (glue). The present method has multiple industrial applications, including making it possible to attach a watch-glass, typically made of mineral glass, sapphire or transparent or translucent ceramics, to a bezel or case middle of a watch case using the anodic bonding technique.