Abstract: The invention relates to a method 100 and an apparatus 300 for cutting or ablating a particular material of the workpiece with a pulsed laser beam coupled into a fluid jet. The method comprises producing the pulsed laser beam with at least one laser source, providing the pressurized fluid jet onto the workpiece, and coupling the pulsed laser beam into the fluid jet towards the workpiece. The pulsed laser beam comprises at least two superimposed pulsations selected based on the particular material of the workpiece. A first pulsation has a different power and frequency than a second pulsation.

Abstract: The invention relates to a method and an apparatus for manufacturing a workpiece, specifically a rough diamond, into a product, specifically a brilliant. The method is performed by an apparatus providing a laser beam coupled into a pressurized fluid jet. The method comprises executing multiple cuts of the workpiece with the laser beam according to a predetermined cut-sequence to remove workpiece material with each completed cut. The method further comprises executing multiple rotations of the workpiece around the same axis of revolution according to a predetermined rotation-sequence. Thereby, a rotation is executed after a completed cut, and for executing a cut the laser beam is moved along a two-dimensional path.

Abstract: The invention relates to an apparatus 100 for 3D shaping of a workpiece 101 by material ablation with a laser beam 102. The apparatus 100 comprises a machining unit 103, which is configured to provide a pressurized fluid jet 104 onto the workpiece 101 and to couple the laser beam 102 into the fluid jet 104 towards the workpiece 101. Further, the apparatus 100 includes a motion controller 105 configured to set an x-y-z-position of the workpiece 101 relative to the machining unit 103. It also includes a measuring unit 107 configured to measure a z-position of the point of incidence 108 of the pressurized fluid jet 104 on the workpiece 101 in the z-direction.

Abstract: The invention relates to an apparatus 100 for machining a workpiece with a laser beam 101 coupled into a fluid jet. The apparatus 100 comprises a laser unit 101a for providing the laser beam 101, a nozzle unit 102 with an aperture 102a for producing the fluid jet, and an optical unit 103 configured to provide the laser beam 101 from the laser unit 101a onto the nozzle unit 102. Further, the apparatus 100 comprises a control unit 104 configured to control 108, 110 the optical unit 103 and/or nozzle unit 102 to change a point of incidence 109 of the laser beam 101 on the nozzle unit 102. The apparatus 100 also comprises a sensing unit 105 configured to sense laser light 106 reflected from a surface 102b of the nozzle unit 102 and produce a sensing signal 107 based on the sensed reflected laser light 106.

Abstract: The invention relates to an apparatus 100, 200, 300, 700 and a method 400 for machining a workpiece 101 with a laser beam 102. The apparatus 100, 200, 300, 700 comprises a machining unit 103 configured to provide a pressurized fluid jet 104 onto the workpiece 101 and to couple the laser beam 102 through at least one optical element 105 into the fluid jet 104 towards the workpiece 101. Further, it comprises a sensing unit 107 arranged to receive a laser-induced electromagnetic radiation 106 propagating away from the workpiece 101 through the fluid jet 104 and through at least one optical element, and configured to convert the received radiation 106 into a signal 108. The apparatus 100, 200, 300, 700 also comprises a signal processing unit 109 configured determine a state of machining the workpiece 101 based on the signal 108.

Abstract: The invention relates to an object (1) that is cut by means of a laser and a water beam and to further processing of the cut material. The object is glued on a carrier (3) that is provided with an adhesive and can be transparent for the radiation used in the water beam (7). The carrier can be a solid body and preferably a fibrous mat (3). Said body or mat is penetrated by the water beam. The object (1) or the cut material thereof is held on the carrier (3) before, during and after cutting through in such a way that said object or material does not change position. In a preferred embodiment, a silicon wafer is used as the object because of the high cutting exactness to be obtained. Other materials can also be used.