Abstract: A system utilizes a laser to remove the mold compound of an IC without damaging the internal die, wire leads, solder connections and any other critical structures encapsulated within the mold compound, thereby leaving them available for the provisional and electrical analysis. A laser beam is focused through appropriate optics onto a plane corresponding to the surface of an IC. A layer of material which is opaque at the wave length of the laser beam is applied at the surface of the IC chip to be ablated prior to each pass of the laser. A spray nozzle may be provided to move in synchronous motion ahead of the laser being to apply coat of the opaque material.

Abstract: A method and system for exposing the delicate structures of a device encapsulated in a mold compound such as an integrated circuit (IC). A laser is used to ablate the mold compound and thus remove it, exposing the underlying structure. The laser beam can be steered in a desired raster pattern onto the surface of the device or the device can be moved in the desired pattern relative to the laser beam. Spectral analysis can be performed on the laser plume emitted by the ablation process in order to determine the composition of the ablated material. Thus, in addition to exposing defects in the underlying structure, the system can also be used to analyze the encapsulating material in order to determine whether it contained any defects or anomalies. A system for precisely cutting a circuit board or an IC in a user-selected pattern is also described. The system directs a laser along a path that a user can specify using a graphical interface.

Abstract: An apparatus is provided for packaging fasteners such as screws, that is to be worn by a user. The packaging device includes a tray with a plurality of wells, each well accommodating the shank of a respective fastener. An attachment device is used for securing a tray to a user. In a preferred dispensing method, fasteners may be dispensed from the tray using a magnetized screwdriver bit which is placed over the head of the fastener, followed by withdrawing the screwdriver bit with the fastener magnetically attached.

Abstract: An apparatus is provided for packaging fasteners such as screws, that is to be worn by a user. The packaging device includes a tray with a plurality of wells, each well accommodating the shank of a respective fastener. An attachment device is used for securing a tray to a user. In a preferred dispensing method, fasteners may be dispensed from the tray using a magnetized screwdriver bit which is placed over the head of the fastener, followed by withdrawing the screwdriver bit with the fastener magnetically attached.

Abstract: An apparatus is provided for packaging fasteners such as screws, that is to be worn by a user. The packaging device includes a tray with a plurality of wells, each well accommodating the shank of a respective fastener. An attachment device is used for securing a tray to a user. In a preferred dispensing method, fasteners may be dispensed from the tray using a magnetized screwdriver bit which is placed over the head of the fastener, followed by withdrawing the screwdriver bit with the fastener magnetically attached.

Abstract: An apparatus is provided for packaging fasteners such as screws, that is to be worn by a user. The packaging device includes a tray with a plurality of wells, each well accommodating the shank of a respective fastener. An attachment device is used for securing a tray to a user. In a preferred dispensing method, fasteners may be dispensed from the tray using a magnetized screwdriver bit which is placed over the head of the fastener, followed by withdrawing the screwdriver bit with the fastener magnetically attached.

Abstract: A package wrapping machine has a frame supporting a power driven rotary horizontal shaft with a turret plate member on the end of the shaft supporting two spaced tine banks; a stack of package components is clamped between the tine banks by pneumatic cylinders on the turret plate moving one tine bank toward the other. The end of a plastic film web W extending from a roll on the frame is clamped to the package components when they are rotated a predetermined number of rotations to effect the wrapping of the package components; a hot film cut-off means severs the web of plastic film from the wrapped package following the wrapping of the package and a pusher plate between the tine banks is extended by a cylinder to kick the completed package from between the tine banks, control means actuates the clamping means, rotary member, said film cut-off means and pusher plate in timed sequence.