Abstract: A method and apparatus for positioning a plurality of workpieces in a tightly spaced array within a guide block. The apparatus of the invention includes an insertion head mounted to a robot assembly arm. The insertion head includes a pair of resiliently mounted gripper fingers that can be operated to pick up an individual workpiece from a supply station. The gripper fingers include a spring member that biases the gripper fingers into an engagement position. Once the workpiece has been acquired by the insertion head, the insertion head is used to alternately rotate the workpiece while applying a downward force to slide the workpiece into the defined location within a receptacle. After the workpiece has been inserted, the gripper fingers are moved to their retracted position to press the workpiece completely downward into the receptacle.