Patents Assigned to Systran Corporation
  • Patent number: 6751699
    Abstract: FC and FX mini-hubs with a limited number of ports, e.a., 4-8 ports, provide a wide variety of configurations for small form factors. The mini-hubs provide compact, low cost hubs for form factors that can include PMC, CompactPCI, and VME. The mini-hubs are installed into an unused system slot of a host computer or as a mezzanine card for use in the host computer. Thus, the mini-hubs use power received directly from the backplane of the host computer so that no external power connections are required and mechanical support is provided by the system chassis or carrier card into which a mini-hub is installed. The mini-hubs eliminate external communication/control cabling since managed mini-hubs are controlled directly via the system bus of the host computer. This direct communication also reduces system latency.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: June 15, 2004
    Assignee: Systran Corporation
    Inventors: Richard Wade Langley, Sr., Paul Martin Davis
  • Patent number: 6259648
    Abstract: A pseudo dual port memory is constructed using a zero bus turnaround random access memory (RAM) wherein data words stored in the RAM each make up a plurality of data words for the pseudo dual port memory. Words written to the dual port memory are accumulated to assemble a single RAM word which is written into an addressed location within the RAM. Words read from the RAM correspondingly make up a plurality of data words for the dual port memory and are stored and multiplexed out as individual words. In the illustrated embodiment, each RAM word comprises two dual port memory words; however, other multiples, preferably powers of 2, can be used in the present invention such that each RAM word can comprise 4, 8, 16, etc. dual port memory words.
    Type: Grant
    Filed: March 21, 2000
    Date of Patent: July 10, 2001
    Assignee: Systran Corporation
    Inventor: Nathan Andrew Kragick
  • Patent number: 5982634
    Abstract: A compact, high speed switch packaging arrangement or package provides reduced path lengths for electrical paths through the package. In particular, a printed circuit board switch backplane supports a switching subsystem and connects the switching subsystem to pairs of electrical connectors with the pairs of connectors being positioned on opposite edges of the same side of the backplane. A plurality of port boards for processing signals to be switched by the switching subsystem each include pairs of connectors which intermate with the pairs of connectors on the backplane. Port circuitry on the port boards is connected to the port board connectors to minimize trace lengths on the port boards by routing ports to the nearest one of the two connectors. The port boards are mounted to the backplane such that signals from the port boards are routed to the switching subsystem from two opposite sides of the switching subsystem.
    Type: Grant
    Filed: November 14, 1996
    Date of Patent: November 9, 1999
    Assignee: Systran Corporation
    Inventor: Leszek Dariusz Wronski
  • Patent number: 4928289
    Abstract: Apparatus and method for encoding data in an AC coupled bi-polar data transmission system. A stream of binary data is encoded to produce first and second binary code signals for transmission on a pair of transmission lines. Except as provided by the encoding technique, both binary code signals undergo a change of state for each data bit time. The signal on one line undergoes a transition for each bit time except when the data signal is changing from zero to one. The other transmission line undergoes a change of state for each bit time except when the data signal changes from one to zero. Decoding of the transmitted signals is achieved by applying both signals to an exclusive OR gate.
    Type: Grant
    Filed: December 19, 1988
    Date of Patent: May 22, 1990
    Assignee: Systran Corporation
    Inventor: Drake D. Dingeman
  • Patent number: 4819177
    Abstract: A method for curing rubber in a heated mold in which the temperature of the mold is measured after closure and variations in temperature from an optimum cure temperature are used to adjust elapsed cure times which decrement an optimum cure time. The adjustment of elapsed cure time is determined by an algorithm which utilizes the 18.degree. F. (10.degree. C.) doubling rule; that is, that the rate of cure doubles for each increase in temperature of 18.degree. F. (10.degree. C.) and halves for each decrease in temperature of 18.degree. F. (10.degree. C.). Accordingly, the algorithm reduces the cure time remaining at a rate exceeding the actual elapsed time if the temperature of the mold is measured and determined to be above the optimum or set point temperature, and conversely, the cure time remaining is lengthened by reducing the cure time remaining at a rate below the actual elapsed time rate if the measured temperature of the mold is below the set point temperature.
    Type: Grant
    Filed: June 19, 1987
    Date of Patent: April 4, 1989
    Assignee: Systran Corporation
    Inventor: John R. Jurgensen
  • Patent number: 4748854
    Abstract: A fatigue test apparatus in which a specimen to be tested is attached at its ends to a pair of opposing pistons positioned within a pair of opposing cylinders. The cylinders are attached to a support frame such that the specimen is oriented substantially vertically. In a preferred embodiment, the specimen is enclosed in a heat chamber to test at high temperatures. Each of the pistons is attached to a shaft having a weight at its end and the weights are drivingly connected to a pair of shakers which are actuated to vibrate 180.degree. out of phase with each other. The cylinders are pressurized to exert a static tensile load on the specimen, and the shakers are actuated to exert a dynamic tensile load which is superimposed on the static load and travels through the weights, shafts and pistons to the specimen.
    Type: Grant
    Filed: October 24, 1986
    Date of Patent: June 7, 1988
    Assignee: Systran Corporation
    Inventor: Dantam K. Rao