Abstract: Methods of manufacturing printed circuit boards are disclosed. The methods utilize various printing techniques to apply conductive compositions to substrates in the creation of printed circuit boards. The method of manufacturing printed circuit board comprises the step of applying conductive composition to a substrate through a cold welding process.
Type:
Grant
Filed:
January 3, 2001
Date of Patent:
November 4, 2003
Assignee:
T-Ink, L.L.C.
Inventors:
Terrance Z. Kaiserman, Keith J. Margolin