Abstract: An apparatus for burn-in of semiconductor devices has board assemblies including a burn-in board and a driver board. The burn-in board has sockets on a first surface for accepting the semiconductor devices and first terminals extending from the sockets to protrude from a first back side of the burn-in board. The driver board has a second surface carrying an electronic circuit to drive the semiconductor devices and a second back side with second terminals for connecting the electronic circuit to the first terminals. The driver board has an edge connector with terminals for applying power to the electronic circuit. The burn-in board and the driver board are disposed with the first and second back sides facing such that corresponding ones of the first and second terminal can be brought into and out of contact with each other. The board assemblies are supported in a housing wherein the board assemblies form partitions isolating first and second environmental spaces for burn-in and cooling operation.

Abstract: A temperature control method for controlling a temperature in a chamber comprises the steps of: providing heating means which can select large and small heating powers for heating the chamber and refrigerating means for cooling the chamber; detecting a process temperature in the chamber; operating the heating means with a small heating power for attaining an intended set value when a detected temperature is equal to or higher than a lower tolerable deviation value, and operating the heating means with a large heating power when the detected temperature is lower than the lower tolerable deviation value; and operating the refrigerating means when the detected temperature is higher than an upper tolerable deviation value.

Abstract: A thermal shock chamber comprising a test area, a high-temperature air conditioning unit having a gas outlet and a gas inlet adjacent to the test area, an outside air supplying unit having an air outlet and an air inlet adjacent to the test area, a low-temperature air conditioning unit having a gas outlet and a gas inlet adjacent to the test area, a first damper assembly for opening the outlet and the inlet of one of the high-temperature air conditioning unit and the outside air supplying unit and closing the outlet and the inlet of the other unit at the same time, and a second damper assembly for opening the outlet and the inlet of one of the low-temperature air conditioning unit and the outside air supplying unit and closing the outlet and the inlet of the other unit at the same time.