Patents Assigned to Tadatomo Suga
-
Patent number: 10166749Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.Type: GrantFiled: January 30, 2012Date of Patent: January 1, 2019Assignees: LAN TECHNICAL SERVICE CO., LTD., TADATOMO SUGAInventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
-
Patent number: 8915418Abstract: The present invention ensures a good bonding state between the electrode terminals of electronic components and the electrodes of a substrate, and achieves an increase in productivity and a downsizing of the substrate. The present invention includes: an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components with different heights, on the multiple electrodes, respectively; an organic film placing step of placing an organic film on the multiple electronic components; an organic film compressing step of applying a first pressure to the electronic component side with a pressing member and equalizing the height of the organic film; and a bonding step of applying a second pressure to the electronic component side with a compressing member on heating for a predetermined time and sintering the metal fine powder paste.Type: GrantFiled: March 13, 2014Date of Patent: December 23, 2014Assignees: Tadatomo Suga, Masataka Mizukoshi, Alpha Design Co., Ltd.Inventors: Toshiyuki Shiratori, Toru Kawasaki, Tadatomo Suga, Masataka Mizukoshi
-
Patent number: 8651363Abstract: A practical bonding technique is provided for solid-phase room-temperature bonding not requiring a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. Since an adhering substance layer is thin immediately after a surface activating treatment using an energy wave, a bonding interface is spread by crushing the adhering substance layer to perform bonding, so that a new surface appears on a bonding surface, and objects to be bonded are bonded together. In order to crush the adhering substance layer more easily, a bonding metal of a bonding portion of the object to be bonded requires a low hardness. According to the results of various experiments conducted by the present inventors, it was found that the hardness of the bonding portion which is a Vickers hardness of 200 Hv or less is particularly effective for room-temperature bonding.Type: GrantFiled: November 16, 2011Date of Patent: February 18, 2014Assignees: Bondtech, Inc., Tadatomo SUGAInventors: Tadatomo Suga, Masuaki Okada
-
Publication number: 20120104076Abstract: A practical bonding technique is provided for solid-phase room-temperature bonding not requiring a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. Since an adhering substance layer is thin immediately after a surface activating treatment using an energy wave, a bonding interface is spread by crushing the adhering substance layer to perform bonding, so that a new surface appears on a bonding surface, and objects to be bonded are bonded together. In order to crush the adhering substance layer more easily, a bonding metal of a bonding portion of the object to be bonded requires a low hardness. According to the results of various experiments conducted by the present inventors, it was found that the hardness of the bonding portion which is a Vickers hardness of 200 Hv or less is particularly effective for room-temperature bonding.Type: ApplicationFiled: November 16, 2011Publication date: May 3, 2012Applicants: Tadatomo SUGA, Bondtech, Inc.Inventors: TADATOMO SUGA, Masuaki Okada
-
Publication number: 20100252615Abstract: A practical bonding technique is provided for solid-phase room-temperature bonding which does not require a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. Since an adhering substance layer is thin immediately after a surface activating treatment using an energy wave, a bonding interface is spread by crushing the adhering substance layer to perform bonding, so that a new surface appears on a bonding surface, and objects to be bonded are bonded together. In order to crush the adhering substance layer more easily, a bonding metal of a bonding portion of the object to be bonded needs to have a low hardness. According to the results of various experiments conducted by the present inventors, it was found that the hardness of the bonding portion which is a Vickers hardness of 200 Hv or less is particularly effective for room-temperature bonding.Type: ApplicationFiled: June 21, 2010Publication date: October 7, 2010Applicants: Bondtech, Inc., Tadatomo SUGAInventors: Tadatomo Suga, Masuaki Okada
-
Publication number: 20070128825Abstract: A method for bonding of substrates has a steps of irradiating surfaces of the substrates respectively in a vacuum with both an inert gas beam and a metal beam thereby forming island shaped thin metal films on the surfaces of the substrates, and surface-activated bonding of the substrates through the island shaped thin metal films by contacting the surfaces of the substrates each other.Type: ApplicationFiled: December 2, 2005Publication date: June 7, 2007Applicants: Tadatomo Suga, Ayumi Industry Co., Ltd.Inventors: Tadatomo Suga, Mohammad Howlader, Tomoyuki Abe
-
Publication number: 20060192578Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.Type: ApplicationFiled: May 2, 2006Publication date: August 31, 2006Applicants: TOKYO ELECTON LIMITED, TADATOMO SUGA, TOSHIHIRO ITOHInventors: Shinji Iino, Kiyoshi Takekoshi, Tadatomo Suga, Toshihiro Itoh, Kenichi Kataoka
-
Publication number: 20040211060Abstract: A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.Type: ApplicationFiled: April 21, 2004Publication date: October 28, 2004Applicants: Tadatomo SUGA, SHINKO ELECTRIC INDUSTRIES CO., LTD, Oki Electric Industry Co., Ltd., SANYO ELECTRIC CO., LTD., SHARP KABUSHIKI KAISHA, SONY CORPORATION, KABUSHIKI KAISHA TOSHIBA, NEC CORPORATION, HITACHI, LTD., FUJITSU LIMITED, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., MITSUBISHI DENKI KABUSHIKI KAISHA, ROHM CO., LTD.Inventors: Tadatomo Suga, Toshihiro Itoh, Hideto Nakazawa, Masatoshi Akagawa
-
Publication number: 20040174177Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.Type: ApplicationFiled: March 18, 2004Publication date: September 9, 2004Applicants: TOKYO ELECTRON LIMITED, TADATOMO SUGA, TOSHIHIRO ITOHInventors: Shinji Iino, Kiyoshi Takekoshi, Tadatomo Suga, Toshihiro Itoh, Kenichi Kataoka
-
Patent number: 6777967Abstract: Disclosed is an inspection method for inspecting the electrical characteristics of a device by bringing an inspecting probe into electrical contact with an inspection electrode. An insulating film formed on the surface of the inspection electrode is broken by utilizing a fritting phenomenon so as to bring the inspection electrode into electrical contact with the inspection electrode.Type: GrantFiled: August 20, 2001Date of Patent: August 17, 2004Assignees: Tokyo Electron Limited, Tadatomo Suga, Toshihiro ItohInventors: Shinji Iino, Kiyoshi Takekoshi, Tadatomo Suga, Toshihiro Itoh, Kenichi Kataoka