Patents Assigned to TAESAN ENGINEERING CO., LTD.
  • Patent number: 8840963
    Abstract: The present invention relates to an aqueous epoxy resin composition which is able to contain a large amount of water because it uses an epoxy resin and a coagulant and thereby allows an emulsifier and water to be stably adsorbed and captured on tangled particle surfaces of the coagulant. The aqueous epoxy resin composition according to the present invention comprises a highly compatible formulation producing a good cross-linking bond in a curing reaction with a curing agent and hence it can effect functions including those of a coating agent, a primer agent, a mortar agent and an adhesive agent in a two-part formulation, and it entails a formulation using absolutely no volatile organic compounds in large amounts and hence it is environmentally-friendly and can also markedly reduce production costs.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: September 23, 2014
    Assignee: Taesan Engineering Co., Ltd
    Inventor: Sang Yang Kim
  • Publication number: 20130022748
    Abstract: The present invention relates to am aqueous epoxy resin composition, and to an aqueous epoxy resin composition which is able to contain a large amount of water because it uses an epoxy resin and a coagulant and thereby allows an emulsifier and water to be stably adsorbed and captured on tangled particle surfaces of the coagulant. The aqueous epoxy resin composition according to the present invention comprises a highly compatible formulation producing a good cross-linking bond in a curing reaction with a curing agent and hence it can effect functions including those of a coating agent, a primer agent, a mortar agent and an adhesive agent in a two-part formulation, and it entails a formulation using absolutely no volatile organic compounds in large amounts as is the case with prior-art epoxy resin composition and hence it is environment-friendly and can also markedly reduce production costs.
    Type: Application
    Filed: April 27, 2011
    Publication date: January 24, 2013
    Applicant: TAESAN ENGINEERING CO., LTD.
    Inventor: Sang Yang Kim