Patents Assigned to Tagleef Industries PTY Ltd.
  • Patent number: 10201954
    Abstract: A multilayer, metallized, laminate film employed to form in-mold labels, includes first and second multilayer structures adhesively bonded together. The first multilayer structure (12) includes a polymer core layer (16) and first and second outer polymer layers on opposed sides of the core layer. The first outer polymer layer (18) includes a metal layer (22) thereon, and the second polymer layer (20) having an outer matte surface that is adapted, in the in-mold label formed from laminate film, to engage and bond to a molded article. The second multilayer structure (14) is a clear structure including a core layer (16?) and first (18?) and second (20?) outer polymer layers on opposed sides of the core layer. The bonded interface of the first and second multilayer structures is free of any printed indicia or other graphics. Preferably both outer surfaces of the film are bottom outer layers and include matte surfaces.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: February 12, 2019
    Assignee: Tagleef Industries PTY Ltd.
    Inventors: Roger Beardwell, Steven Hodgson