Patents Assigned to Tagsense, Inc.
  • Blister package with integrated electronic tag and method of manufacture
    Patent number: 8525677
    Abstract: A blister package with an integrated RFID tag is provided. The conductive lidding material is modified to serve not only to seal some contents within some formed blister film, but also to act as an RFID tag antenna. An electronic circuit is electrically connected to the lidding film antenna. Methods of manufacture which integrate with conventional blister package manufacturing processes are also provided.
    Type: Grant
    Filed: February 20, 2012
    Date of Patent: September 3, 2013
    Assignees: TagSense, Inc.
    Inventors: Tom Ahlkvist Scharfeld, Richard Fletcher
  • Blister Package with Integrated Electronic Tag and Method of Manufacture
    Publication number: 20120145573
    Abstract: A blister package with an integrated RFID tag is provided. The conductive lidding material is modified to serve not only to seal some contents within some formed blister film, but also to act as an RFID tag antenna. An electronic circuit is electrically connected to the lidding film antenna. Methods of manufacture which integrate with conventional blister package manufacturing processes are also provided.
    Type: Application
    Filed: February 20, 2012
    Publication date: June 14, 2012
    Applicants: TagSense, Inc.
    Inventors: Tom Ahlkvist Scharfeld, Richard Fletcher
  • Blister package with integrated electronic tag and method of manufacture
    Patent number: 8120492
    Abstract: A blister package with an integrated RFID tag is provided. The conductive lidding material is modified to serve not only to seal some contents within some formed blister film, but also to act as an RFID tag antenna. An IC chip is electrically connected to the lidding film antenna. Methods of manufacture which integrate with conventional blister package manufacturing processes are also provided.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: February 21, 2012
    Assignees: Tagsense, Inc.
    Inventors: Tom Ahlkvist Scharfeld, Richard Fletcher
  • Blister Package with Integrated Electronic Tag and Method of Manufacture
    Publication number: 20060202830
    Abstract: A blister package with an integrated RFID tag is provided. The conductive lidding material is modified to serve not only to seal some contents within some formed blister film, but also to act as an RFID tag antenna. An IC chip is electrically connected to the lidding film antenna. Methods of manufacture which integrate with conventional blister package manufacturing processes are also provided.
    Type: Application
    Filed: February 25, 2005
    Publication date: September 14, 2006
    Applicants: TAGSENSE, INC.
    Inventors: Tom Scharfeld, Richard Fletcher
  • Electromagnetic identification label for anti-counterfeiting, authentication, and tamper-protection
    Patent number: 6891474
    Abstract: A radio frequency identification label is comprised of a tag circuit 310 electrically coupled to a defined marker region 330 such that the information generated by the tag circuit is dependent on the electronic properties of the marker region 330. The ID information conveyed to an external tag reader is thus a combination of fixed data intrinic to the tag circuit 310 plus a portion of data that is dependent on the electronic properties of the marker region. The marker region 330 can be comprised of various materials with complex structure, such as woven cloth or printed electrically conductive inks, such that the ID code transmitted by the label is thus more difficult to reproduce or to counterfeit. In addition, the marker region 330 can also be arranged to have electrical coupling to the object onto which the label is affixed, thus creating an electronic ID code that is also dependent on the electronic properties of the tagged object itself.
    Type: Grant
    Filed: August 1, 2002
    Date of Patent: May 10, 2005
    Assignee: Tagsense, Inc.
    Inventor: Richard Fletcher