Patents Assigned to Tai-Electric Wire & Cable Co., Ltd.
  • Publication number: 20140102754
    Abstract: A structure of a networking cable includes a plurality of transmission wires and a plastic outer sheath being a hollow tube for sleeving the transmission wires therein. The plastic outer sheath is formed with at least one hollow compartment extending along a longitudinal length thereof. Capacitance among networking cables can be reduced due to the low dielectric constant of the air inside each hollow compartment, such that the strength of the alien crosstalk can be reduced. The arrangement of shape and symmetry of the hollow compartments with respect to the transmission wires can be used to reduce the alien crosstalk resulted from resonance. Moreover, the usage of raw material is decreased, such that the cost is reduced.
    Type: Application
    Filed: October 15, 2012
    Publication date: April 17, 2014
    Applicant: Ching Tai Electric Wire & Cable Co., Ltd.
    Inventors: Tai-Der Yeh, Wen-Hsiang Han
  • Patent number: 6376073
    Abstract: A high frequency-resistant thermosetting coating is provided for the manufacture of high frequency-resistant enamelled wires. A high frequency-resistant enamelled wire produced from the high frequency-resistant thermosetting coating is also provided. The adhesion, crosslinking density, abrasion resistance, and softening resistance of the coating are excellent. With the same nominal diameter and a coating thickness more than 85 &mgr;m, the high frequency resistant lifetime of the enamelled wire produced from the high frequency-resistant thermosetting coating is 3 to 4 times as that of conventional thermoplastic enamelled wires.
    Type: Grant
    Filed: January 20, 2000
    Date of Patent: April 23, 2002
    Assignee: Tai-Electric Wire & Cable Co., Ltd.
    Inventors: Chih-Min Jang, Ru-Shi Liu, Chi-Ting Du, Wen-Cheng Wu, Yung-Chin Lin, Shang-Yen Chang, Wen-Lu Tai, Yao-Chung Tu, Wen-Hsiung Liu