Abstract: A resonance element supported by a bearing structure includes a crystal chip and an excitation electrode. The crystal chip includes a main surface having a support surface portion being in contact with the bearing structure. The excitation electrode is disposed on the main surface, has an electrode area, and includes an electrode indentation boundary partly encompassing the support surface portion. The electrode indentation boundary has a first boundary end and a second boundary end being opposite to the first boundary end. The electrode indentation boundary and a reference line segment defined by the first and the second boundary ends form an electrode indentation region having an indentation area. A ratio of the indentation area to the electrode area ranges from 0.05 to 0.2.

Abstract: A crystal device includes a bearing base, an integrated chip and a conductive adhesive unit. The bearing base includes a conductive seat. The integrated chip includes a principal reference plane facing the conductive seat, and having a first major axis. The conductive adhesive unit has a second major axis and an aspect ratio, and is at least partly disposed between the conductive seat and the integrated chip. The aspect ratio ranges from 1.1 to 1.9. The principal reference plane further has a perpendicular projection straight line defined according to the second major axis. A practical angle is included by the first perpendicular projection straight line and the first major axis, and ranges from 0 degree to 90 degrees.

Abstract: A resonance element supported by a bearing structure includes a crystal chip and an excitation electrode. The crystal chip includes a main surface having a support surface portion being in contact with the bearing structure. The excitation electrode is disposed on the main surface, has an electrode area, and includes an electrode indentation boundary partly encompassing the support surface portion. The electrode indentation boundary has a first boundary end and a second boundary end being opposite to the first boundary end. The electrode indentation boundary and a reference line segment defined by the first and the second boundary ends form an electrode indentation region having an indentation area. A ratio of the indentation area to the electrode area ranges from 0.05 to 0.2.

Abstract: A signal filter includes a notch filter and a wideband filter. The notch filter is configured to perform a band-rejection filtering operation according to a band-rejection filtering property. The wideband filter is coupled to the notch filter, and is configured to perform a wideband filtering operation according to a wideband filtering property. The band-rejection filtering property includes a first cutoff frequency, a frequency bandwidth, a relatively high quality factor and a relatively low coupling coefficient. The wideband filtering property includes a second cutoff frequency, a relatively low quality factor and a relatively high coupling coefficient. The first and the second cutoff frequencies have a frequency difference therebetween. A ratio of the frequency difference to the frequency bandwidth is within a preset ratio range being from 2.5% to 20%.

Abstract: An acoustic-wave ladder filter has a first port, a second port and a ground terminal, and includes a series resonator and a shunt circuit. The series resonator is coupled to and disposed between the first and the second ports in series. The shunt circuit is coupled to and disposed between the series resonator and the grounding terminal, and includes a shunt resonator and a functional circuit. The functional circuit is connected in series with the shunt resonator. The functional circuit includes a resistor having a resistance value. The resistance value is greater than 5 Ohms and is smaller than 50 ohms. The functional circuit may further have an inductance.

Abstract: The invention discloses a quasi-volumetric sensing system and method. Plural short-range order (SRO) units are configured on the carrier of a quasi-volumetric device, and arranged as an array, i.e. a long-range order (LRO) unit. Protrusions, configured on the SRO units, can modify the wettability of the carrier to control the liquid volume retained thereon so that the precise volume of the liquid sample or droplets are calculated. Based on the applied force on the LRO unit and the gradient of hydrophilicity-hydrophobicity on the surface, the redundant volume of the liquid sample is removed. Macromolecules, e.g. antibodies, complements, receptor proteins, aptamers, oligosaccharides or oligonucleotides, configured on the protrusions are coupled to specific molecules in the liquid sample or droplets so as to determine characteristics of the specific molecules. Therefore, the open chip device of the invention can be used to achieve the quasi-volumetric measurement and the analysis of specific molecules.

Abstract: A crystal device includes a bearing base, an integrated chip and a conductive adhesive unit. The bearing base includes a conductive seat. The integrated chip includes a principal reference plane facing the conductive seat, and having a first major axis. The conductive adhesive unit has a second major axis and an aspect ratio, and is at least partly disposed between the conductive seat and the integrated chip. The aspect ratio ranges from 1.1 to 1.9. The principal reference plane further has a perpendicular projection straight line defined according to the second major axis. A practical angle is included by the first perpendicular projection straight line and the first major axis, and ranges from 0 degree to 90 degrees.

Abstract: A strip for an electronic device senses a liquid sample. The strip includes a substrate having a first surface, a plurality of protrusions disposed on the first surface, and each having a width, and a hydrophilic layer having a layer surface disposed on the first surface and the plurality of protrusions, and having a second surface opposite to the layer surface, whereby the liquid sample and the second surface have a contact angle therebetween ranging from 2 to 85 degrees when the liquid sample is disposed on the hydrophilic layer.

Abstract: A method for collecting a body fluid sample of a person to be examined is provided. The method comprises steps of: providing a body fluid sample collecting device and a body fluid sample inspection device for collecting the body fluid sample according to a test sampling requirement, wherein the body fluid sample collecting device includes a body fluid sample collecting region having an open hydrophilic layer with a specific layer area, and configured for collecting a predetermined amount of the body fluid sample; from a body surface of the person to be examined, causing the body fluid sample to be collected onto the body fluid sample collecting region until the body fluid sample covers the hydrophilic layer completely; and receiving the body fluid sample from the body fluid collecting region to be inspected in the body fluid sample inspection device.

Abstract: A planar volumetric device for quantifying and handling a body fluid sample is provided. The device has a planar main body, a body fluid sample flow path, an air pump and an air passage. The planar main body includes a first planar surface and a second planar surface. The body fluid sample flow path is disposed in the main body, and has a body fluid sample inlet, a middle junction and a body fluid sample outlet, wherein the middle junction and the body fluid sample outlet define therebetween a specific path segment, by which it is possible to externally observe to which extent the body fluid sample has filled up with the path segment. The air pump is configured to provide an operating air pressure. The air passage has a first end and a second end, wherein the first and the second ends are connected to the air pump and the middle junction respectively, and the specific path segment has a constant volume.

Abstract: A conducting package structure includes a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected to the substrate and a patterned second surface opposite to the first surface.

Abstract: The present invention provides to an antenna. The antenna includes a piezoelectric-substrate layer; and a quasi-fractal radiating layer disposed on the piezoelectric-substrate layer and having a quadrangle sub-structure and a similar structure that is formed by a nth-order self-similar iteration process including a trimming step, a scaling step and a combining step on the basis of the quadrangle sub-structure, where n is an integer greater than zero.

Abstract: A coplanar waveguide fed multiple-input multiple-output (MIMO) antenna device is provided in the present invention. The coplanar waveguide fed multiple-input multiple-output (MIMO) antenna device includes a grounding metal piece; a grounding plane; a first radiation element connected to the grounding plane; and a second radiation element connected to the grounding plane through the grounding metal piece.

Abstract: A coplanar waveguide fed multiple-input multiple-output (MIMO) antenna device is provided in the present invention. The coplanar waveguide fed multiple-input multiple-output (MIMO) antenna device includes a grounding metal piece; a grounding plane; a first radiation element connected to the grounding plane; and a second radiation element connected to the grounding plane through the grounding metal piece.

Abstract: The present invention provides to an antenna. The antenna includes a piezoelectric-substrate layer; and a quasi-fractal radiating layer disposed on the piezoelectric-substrate layer and having a quadrangle sub-structure and a similar structure that is formed by a nth-order self-similar iteration process including a trimming step, a scaling step and a combining step on the basis of the quadrangle sub-structure, where n is an integer greater than zero.

Abstract: Sacrificial electrodes with fractal-shaped are formed on a SAW (surface acoustic wave) device. The sacrificial electrodes discharge electro-static charge in the SAW device for protecting the IDT (inter-digital transducer) from electrostatic break. Moreover, the sacrificial electrodes can control the path and the discharging degree of the electro-static discharge to avoid losing the electro-static discharge protection due to the sacrificial electrodes are broken.

Abstract: Sacrificial electrodes with fractal-shaped are formed on a SAW (surface acoustic wave) device. The sacrificial electrodes discharge electro-static charge in the SAW device for protecting the IDT (inter-digital transducer) from electrostatic break. Moreover, the sacrificial electrodes can control the path and the discharging degree of the electro-static discharge to avoid losing the electrostatic discharge protection due to the sacrificial electrodes are broken.

Abstract: A buffer layer is formed on a substrate and then electronic devices are packed on the buffer layer in the present invention, and problems of lower hermeticity and complex process in the conventional arts can be avoided. Therefore, the present invention provides a packaging structure and method with a better hermeticity and a simpler process. Especially, due to the buffer layer, the planarization for flip-chip bonding can be improved and reduce negative effects of the packing process.

Abstract: Sacrificial electrodes with fractal-shaped are formed on a SAW (surface acoustic wave) device. The sacrificial electrodes discharge electro-static charge in the SAW device for protecting the IDT (inter-digital transducer) from electrostatic break. Moreover, the sacrificial electrodes can control the path and the discharging degree of the electro-static discharge to avoid losing the electro-static discharge protection due to the sacrificial electrodes are broken.

Abstract: An encapsulant easily flows into a space between a substrate and an electronic device and contacts with an active region of the electronic device to affect the characteristic of the electronic device in the conventional arts. The present invention provides a package structure with a retarding structure to efficiently avoid the problem. The package structure comprises an electronic device, a substrate, a retarding structure, and an encapsulant. The substrate has conductive contacts disposed on an upper surface. The electronic device has an active region and conductive pads disposed on a first surface. The electronic device is electrically coupled to the substrate by conductive bumps between the conductive contacts and the corresponding conductive pads. The encapsulant is formed around a periphery of the electronic device. The retarding structure is disposed outside the active region on the first surface of the electronic device for avoiding the encapsulant contacting the active region of the electronic device.