Abstract: A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (TPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (DPDA). The light-absorbing material includes carbon black and silicon dioxide.

Abstract: A composition and a solution for temporary bonding are provided. The composition includes a dianhydride monomer, a light-absorbing monomer, and a light-absorbing material. The light-absorbing monomer includes at least one of N,N,N,N-(p-aminophenyl)-p-phenylenediamine (DPDA) and N,N-(p-aminophenyl)-p-phenylenediamine (TPDA). The light-absorbing material includes carbon black and silicon dioxide.

Abstract: A method of transferring micro devices is provided. A carrier substrate having a first surface and a second surface opposite to each other is provided, wherein a plurality of micro devices is disposed on the first surface, and each micro device binds to the first surface through laser debonding gel. Next, a receiving substrate is subjected to be relatively closer to the first surface, and a mask is provided on the second surface. Afterwards, the second surface with the mask is irradiated with a laser light, so as to keep the micro devices without laser irradiation binding on the first surface, and the micro devices irradiated with the laser light lose adhesive force and transfer to the receiving substrate.

Abstract: A conductive ink is provided. The conductive ink includes a precursor, a reducing agent, and a protective agent, and the precursor includes copper isostearate (Cu(C18H36O2)2), wherein based on the total weight of the conductive ink, the content of the precursor is 40 wt % to 75 wt %, the content of the reducing agent is 20 wt % to 32 wt %, and the content of the protective agent is 5 wt % to 40 wt %.

Abstract: A polyimide polymer is provided. The polyimide polymer includes a repeating unit represented by formula 1.

Abstract: A polyimide polymer is provided. The polyimide polymer includes a repeating unit represented by formula 1.

Abstract: An adhesive composition is provided. The adhesive composition includes an organic silicon polymer, a silicon coupling agent, carboxylic polyester, and a solvent. Based on the total weight of the adhesive composition, the content of the organic silicon polymer is 10 wt % to 60 wt %, the content of the silicon coupling agent is 10 wt % to 60 wt %, and the content of the carboxylic polyester is 10 wt % to 60 wt %.

Abstract: A photosensitive composition is provided. The photosensitive composition includes a composition for forming polyimide, a photoinitiator, a photo cross-linking agent, and a thermal cross-linking agent. The composition for forming polyimide includes a diamine monomer component, an anhydride monomer component, and a polyimide modifier. The diamine monomer component includes a long-chain aliphatic diamine monomer, a carboxylic acid-containing diamine monomer, and a triazole compound. The anhydride monomer component includes a dianhydride monomer and a monoanhydride monomer. The polyimide modifier has a double bond and an epoxy group.

Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar? is A is and 0<X<0.38.

Abstract: An adhesive composition is provided. The adhesive composition includes a mixture (A), wherein the mixture (A) includes a first component (a), a cross-linking agent (b), and a second component (c), wherein the second component (c) includes a calcium-containing complex compound or a calcium-containing compound. Based on the total weight of the mixture (A), a content of the first component (a) is from 40 to 80 wt %, a content of the cross-linking agent (b) is from 20 to 60 wt %, and a content of the second component (c) is from 1 to 20 wt %. Specifically, the calcium-containing complex compound is selected from the group consisting of a compound represented by formula (1), a compound represented by formula (2), a compound represented by formula (3), and a compound represent by formula (4), and the calcium-containing compound is selected from the group consisting of a compound represented by formula (5) and a compound represent by formula (6).

Abstract: A polyimide metal laminated plate has a first metallic film, a first thermoplastic polyimide film laminated on a surface of the first metallic film, a first thermosetting polyimide film laminated on a surface of the first thermoplastic polyimide film distal from the first metallic film, and a second thermoplastic polyimide film laminated on a surface of the first thermosetting polyimide film distal from the first thermoplastic polyimide film. The polyimide metal laminated plate has no adhesive layer, so the polyimide metal laminated plate not only has good heat resistance, flame resistance, anti-chemical properties, and dimensional stability, but also meets the thinning tendency of FPCB. In addition, by the first thermosetting polyimide film and the second thermoplastic polyimide film having a water vapor transmission rate equal to or more than 170 g-?m/m2-day, the delamination and whitening of the polyimide metal laminated plate is prevented.

Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar? is A is and 0<X<0.38.

Abstract: A polyimide polymer represented by the following formula 1 is provided. In formula 1, Ar is Ar? is A is and 0<X<0.38.

Abstract: An infrared absorption film includes a polymer resin substrate, a polymer dispersant and an infrared absorption material. The infrared absorption material has a plurality of tungsten oxide and/or composite tungsten oxide nanoparticles dispersed in the polymer resin substrate by the polymer dispersant, wherein a weight ratio of the polymer dispersant to the infrared absorption material is between 0.3 and 0.6.

Abstract: A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.

Abstract: A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic acid group, and an anhydride monomer having a carboxylic acid group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a polyimide; and mixing the polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.

Abstract: A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic group, and an anhydride monomer having a carboxylic group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a modified polyimide; and mixing the modified polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.

Abstract: A cover layer of a printed circuit board has a polymer film, a reflective composite layer and an adhesive layer. The polymer film has a melting point greater than 260° C. The reflective composite layer is mounted on one side surface of the polymer film and has a first reflective pigment. The adhesive layer is mounted on another side surface of the polymer film. Also, at a range of wavelength where a reflectivity of the cover layer is greater than 89%, absorption of the polymer film to the same range of wavelength is less than 35%. The cover layer is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160° C. to 320° C., the cover layer has a reflectivity over 89% without yellowing and delamination.

Abstract: A thermally conductive encapsulate comprising a thermally conductive composite layer having a thermal conductivity of 0.5 W/m*K to 8 W/m*K and an adhesive resin layer having a thermal conductivity of 0.05 W/m*K to 0.4 W/m*K is provided. A percentage of a thickness of the adhesive resin layer relative to a total thickness of the thermally conductive encapsulate ranges from 0.1% to 10%, and the thermally conductive encapsulate has an overall thermal impedance less than 0.72° C.-in2/W. Accordingly, the thermally conductive encapsulate not only provides sealing, insulating and adhesive properties, but also effectively dissipates the heat to the environment without increasing the thickness or volume of the solar cell module and without modifying the original encapsulation process, and thereby enhancing the solar cell module's conversion efficiency and increasing its power output.

Abstract: Provided is a light-absorbing composition, which is prepared by melt-extruding a mixture containing light-absorbing particle agglomerates and a polymer. The light-absorbing particle agglomerates comprises a dispersant and light-absorbing particles capped with the dispersant, and the light-absorbing particle agglomerates dispersed in the light-absorbing composition and have an average particle size ranging from 10 nanometers to 800 nanometers. Accordingly, the light-absorbing composition can effectively absorb near-infrared light and store infrared heat, and thereby providing infrared-absorbing, heat-insulating and heat-storing abilities. Furthermore, a light-absorbing structure made from the light-absorbing composition has good transparency, higher infrared absorbance, light-absorbing and heat-releasing efficiencies, and is thereby beneficial to keep the temperature equilibrium of buildings or vehicles.