Abstract: A polyimide film includes a polyimide layer including a polyimide base polymer, and a polyimide powder distributed in the polyimide base polymer, the polyimide powder being obtained by reacting a diamine with a dianhydride at a molar ratio of about 1:0.950 to about 1:0.995. Moreover, the polyimide film may have a multilayered structure including at least a second polyimide layer stacked on a surface of the polyimide layer. The second polyimide can also include the polyimide powder at a weight ratio less than about 20 wt % of the total weight of the second polyimide layer. Embodiments described herein also include methods of preparing the polyimide films.
Type:
Grant
Filed:
October 22, 2013
Date of Patent:
February 23, 2016
Assignee:
TAIMIDE TECHNOLOGY INCORPORATED
Inventors:
Chung-Yi Chen, Chih-Wei Lin, Chi-Huan Lo, Shihan Tai
Abstract: A multilayer polyimide-containing film comprises a coloring layer containing a pigment, and a first protection layer disposed on one surface of the coloring layer, the first protection layer having a thickness between about 0.5 and about 3 micrometers. In some embodiments, methods of manufacturing the multilayer polyimide-containing film are also described.
Type:
Application
Filed:
June 29, 2012
Publication date:
March 14, 2013
Applicant:
TAIMIDE TECHNOLOGY INCORPORATED
Inventors:
Paul S. C. WU, Chi-Huan Lo, Ching-Wen Yu, Chung-Yi Chen, Sheng-Yu Huang, Cheng-Han Chen WU, Wen-Hsuan Chung