Patents Assigned to Taiwa Semiconductor Manufacturing Co, Ltd.
  • Publication number: 20220162744
    Abstract: A sputtering target structure includes a body having a first side and an opposing second side. A first sputtering target is coupled to the first side of the body. The first sputtering target includes a first material. A second sputtering target is coupled to the second side of the body. The second sputtering target includes a second material. A rotation mechanism is coupled to the body and is configured to allow rotation of the body from a first orientation to a second orientation.
    Type: Application
    Filed: February 8, 2022
    Publication date: May 26, 2022
    Applicant: Taiwa Semiconductor Manufacturing Co, Ltd.
    Inventors: Ping-Yuan CHEN, Hung-Cheng CHEN, Chih-Hsuan HSIEH, Yu-Hsuan WANG