Patents Assigned to Taiwan Green Point Enterprise Co., Ltd.
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Publication number: 20150316966Abstract: An electronic device may include: a circuit board having a board surface; a heat-generating source including a first electronic component mounted on the board surface of the circuit board; and a heat dissipating panel stacked over the circuit board, having a panel surface, and formed with a first recess that is indented inwardly from the panel surface and that is defined by a first recess-defining wall. The first electronic component protrudes from the board surface into the first recess to contact the first recess-defining wall.Type: ApplicationFiled: April 28, 2015Publication date: November 5, 2015Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Yung-Chih CHEN, Jun-Wei SU, Chien-Hsiang HSIEH, Jung-Chi LIU, Yu-Lin HSIEH
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Publication number: 20150253904Abstract: A touch sensitive housing includes an insulator housing and conductive first and second touch sensor layers formed on the insulator housing, stacked one over the other and insulated from each other. At least one of the first and second touch sensor layers includes a patterned seed sub-layer including a catalytically active metal useful for activating electroless plating and a base sub-layer of a base metal formed on the seed sub-layer and having structural characteristics indicative of the base sub-layer being formed by electroless plating techniques.Type: ApplicationFiled: March 3, 2015Publication date: September 10, 2015Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Sheng-Hung YI, Pen-Yi LIAO, Huai-Liang CHIEN
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Publication number: 20150245426Abstract: An illuminating device includes an insulative housing, at least two electrodes and a light source. The insulative housing has opposite front and rear surfaces and is formed with at least two through holes. Each of the through holes is defined by a hole wall and penetrates the front and rear surfaces. Each of the electrodes includes a first conductive segment formed proximate the front surface, a second conductive segment formed proximate the rear surface, and a connecting segment formed inside a respective one of the through holes and interconnecting electrically the first and second conductive segments. The light source is disposed on the front surface and includes first and second connecting terminals each being electrically coupled to the first conductive segment of a corresponding one of the electrodes.Type: ApplicationFiled: February 23, 2015Publication date: August 27, 2015Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Pen-Yi LIAO, Chung-Ho LIU, Hung-Chun CHEN
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Publication number: 20150151466Abstract: A molding machine, which is operable to mold plastic granules into a plastic piece, includes a machine body, a platform, a heater, and a pressing unit. The platform is installed at the machine body and defines a molding cavity to receive the plastic granules. The heater is installed at the machine body adjacent to the platform. The pressing unit is installed at the machine body and disposed above the platform. The pressing unit includes a pressure cylinder, a telescopic rod driven by the pressure cylinder to extend downward and retract upward, and a pressing plate coupled to the telescopic rod and disposed to correspond in position with the molding cavity, and driven by the pressure cylinder to move relative to the platform.Type: ApplicationFiled: April 29, 2014Publication date: June 4, 2015Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Chin-Chun CHENG, Shun-Tien HUNG
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Publication number: 20150129288Abstract: A circuit substrate includes: a substrate; an insulating coating layered structure formed on the substrate, having top and bottom surfaces, and formed with a patterned recess that is indented inwardly from the top surface, that is disposed above the bottom surface, and that is defined by a recess-defining wall, the recess-defining wall having a bottom wall portion and a surrounding wall portion that extends upwardly from a periphery of the bottom wall portion; and a patterned metallic layered structure including an electroless plating metal layer formed on the bottom wall portion of the recess-defining wall.Type: ApplicationFiled: November 13, 2013Publication date: May 14, 2015Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Pen-Yi LIAO, Tsung-Han WU, Fu-Pin TANG, Mei-Chun CHEN, Yu-Jen CHOU
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Publication number: 20150061211Abstract: A card feeder has the following elements. A card hopper is disposed on a base to store cards. A conveying unit is disposed on the base. A friction element is disposed on the base and located in a path passed by the cards, and is capable of providing friction force to the cards so as to separate the cards.Type: ApplicationFiled: December 10, 2013Publication date: March 5, 2015Applicant: Taiwan Green Point Enterprises Co., LTDInventors: I-Chung Hou, Hsun-Hao Chan
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Publication number: 20150044640Abstract: An endodontic post assembly includes a connecting member and a plurality of post structures. The connecting member includes a base and a plurality of connecting nodes connected to the base. Each of the post structures has a root portion connected to a respective one of the connecting nodes, and an apical portion opposite to the root portion. A method of producing the endodontic post assembly and a method of using a sterilization package in endodontic treatment are also provided.Type: ApplicationFiled: January 10, 2014Publication date: February 12, 2015Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventor: Pi-Ying LIU
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Patent number: 8952919Abstract: A method for making a capacitive touch sensitive housing, comprises: forming a non-patterned active metal layer on a housing wall; patterning the non-patterned active metal layer on the housing wall by laser ablation such that the non-patterned active metal layer is formed into a patterned active metal layer including a plurality of plating portions separated from each other, and a plurality of non-plating portions separated from the plating portions; and forming a metal layer on the patterned active metal layer such that the metal layer has first portions formed on the plating portions of the patterned active metal layer, and second portions formed on the non-plating portions of the patterned active metal layer.Type: GrantFiled: March 4, 2014Date of Patent: February 10, 2015Assignee: Taiwan Green Point Enterprises Co., Ltd.Inventors: Sheng-Hung Yi, Pen-Yi Liao
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Publication number: 20140183020Abstract: A method for making a capacitive touch sensitive housing, comprises: forming a non-patterned active metal layer on a housing wall; patterning the non-patterned active metal layer on the housing wall by laser ablation such that the non-patterned active metal layer is formed into a patterned active metal layer including a plurality of plating portions separated from each other, and a plurality of non-plating portions separated from the plating portions; and forming a metal layer on the patterned active metal layer such that the metal layer has first portions formed on the plating portions of the patterned active metal layer, and second portions formed on the non-plating portions of the patterned active metal layer.Type: ApplicationFiled: March 4, 2014Publication date: July 3, 2014Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Sheng-Hung YI, Pen-Yi LIAO
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Publication number: 20140116885Abstract: A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.Type: ApplicationFiled: January 7, 2014Publication date: May 1, 2014Applicant: Taiwan Green Point Enterprises Co., Ltd.Inventors: Sheng-Hung Yi, Pen-Yi Liao
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Publication number: 20140102775Abstract: A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.Type: ApplicationFiled: December 19, 2013Publication date: April 17, 2014Applicant: Taiwan Green Point Enterprises Co., Ltd.Inventors: Sheng-Hung Yi, Pen-Yi Liao
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Patent number: 8692790Abstract: A capacitive touch sensitive housing comprises: a housing wall; an array of capacitive touch sensor pads formed on the housing wall; a plurality of conductive bonding pads formed on the housing wall; and a plurality of conductive lines formed on the housing wall. Each conductive line extends from a respective one of the touch sensor pads to a respective one of the bonding pads and cooperates with the respective one of the capacitive touch sensor pads and the respective one of the bonding pads to define a touch sensor unit having a layered structure including an active metal layer and an electroless deposited metal layer. The active metal layer contains an active metal capable of initiating electroless deposition.Type: GrantFiled: October 31, 2011Date of Patent: April 8, 2014Assignee: Taiwan Green Point Enterprises Co., Ltd.Inventors: Sheng-Hung Yi, Pen-Yi Liao
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Publication number: 20140014401Abstract: A circuit device includes: a substrate having an insulative upper surface; a hydrophobic anti-plating layer of a hydrophobic material formed on the upper surface of the substrate and having at least one patterned through-hole for exposing a plating portion of the upper surface of the substrate; an active metal layer formed on the plating portion of the upper surface of the substrate and disposed in the patterned through-hole in the hydrophobic anti-plating layer; and an electroless deposited metal layer electroless deposited on the active metal layer.Type: ApplicationFiled: July 12, 2012Publication date: January 16, 2014Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Pen-Yi LIAO, Ming-Chun WU, I-Lin TSENG, Tsung-Han WU, Jung-Chi LIN
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Patent number: 8621749Abstract: A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region.Type: GrantFiled: February 25, 2011Date of Patent: January 7, 2014Assignee: Taiwan Green Point Enterprises Co., LtdInventors: Shen-Hung Yi, Pen-Yi Liao
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Publication number: 20130240252Abstract: A 3D-shaped component includes a 3D-shaped plastic film having a surface, and a circuit trace pattern that is disposed at the surface of the 3D-shaped plastic film, that is embedded in the 3D-shaped plastic film, and that is made from a cured conductive ink.Type: ApplicationFiled: December 11, 2012Publication date: September 19, 2013Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTDInventors: Yen-Chou CHEN, Cheng-Yeh HSIAO, Wen-Pao YANG
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Publication number: 20130194722Abstract: A supercapacitor module includes: two main substrates each including an insulator plate, at least one electrical conductive unit formed on a surface of the insulator plate facing toward the other one of the two main substrates, and a circuit unit electrically connecting the electrical conductive unit to an external power; a separator film unit including a liquid-permeable insulating film disposed between the two main substrates; and an electrolyte filled between the two main substrates and cooperating with the liquid-permeable insulating film and the electrical conductive units of the two main substrates to form at least one supercapacitor between the two main substrates.Type: ApplicationFiled: January 22, 2013Publication date: August 1, 2013Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTDInventor: TAIWAN GREEN POINT ENTERPRISES CO., LTD
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Publication number: 20130187813Abstract: A method for manufacturing a sensing electrical device includes the following steps; (a) forming a conductive trace on an insulating substrate; (b) placing the insulating substrate with the conductive trace in a mold cavity of a mold; (c) injecting an insulating material into the mold cavity to encapsulate the conductive trace to form an injection product; and (d) removing the injection product from the mold cavity.Type: ApplicationFiled: January 23, 2013Publication date: July 25, 2013Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventor: TAIWAN GREEN POINT ENTERPRISES CO., LTD.
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Publication number: 20130052294Abstract: A method of making a molding tool includes: preparing an imprinting master having a surface relief pattern; applying a curable material on a flexible film; embossing the curable material on the flexible film using the imprinting master so as to transfer the surface relief pattern to the curable material; curing the embossed curable material so as to form a patterned-and-cured material; attaching and conforming the flexible film to a non-planar surface of a model; forming a thin metal film over the patterned-and-cured material; electroforming a metal layer over the thin metal film so as to form a molding tool of the metal layer; and removing the molding tool from the thin metal film.Type: ApplicationFiled: March 30, 2011Publication date: February 28, 2013Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Shaupoh Wang, Ray Long Tsai, Tung Chuan Chen, Pei Shan Hsieh, Hui Mei Chang, Shih Tsung Chang
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Publication number: 20120273261Abstract: A circuit substrate includes: an insulative substrate formed with a pattern of a recess, the recess being defined by a recess-defining wall that has a bottom wall surface and a surrounding wall surface extending upwardly from the bottom wall surface; a patterned metallic layer structure including at least a patterned active metal layer disposed within the recess, formed on the bottom wall surface of the recess-defining wall, and spaced apart from the surrounding wall surface of the recess-defining wall, the patterned active metal layer containing an active metal capable of initiating electroless plating; and a primary metal layer plated on the patterned metallic layer structure.Type: ApplicationFiled: July 12, 2012Publication date: November 1, 2012Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Sheng-Hung YI, Pen-Yi LIAO
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Publication number: 20120217145Abstract: A capacitive touch sensitive housing comprises: a housing wall; an array of capacitive touch sensor pads formed on the housing wall; a plurality of conductive bonding pads formed on the housing wall; and a plurality of conductive lines formed on the housing wall. Each conductive line extends from a respective one of the touch sensor pads to a respective one of the bonding pads and cooperates with the respective one of the capacitive touch sensor pads and the respective one of the bonding pads to define a touch sensor unit having a layered structure including an active metal layer and an electroless deposited metal layer. The active metal layer contains an active metal capable of initiating electroless deposition.Type: ApplicationFiled: October 31, 2011Publication date: August 30, 2012Applicant: TAIWAN GREEN POINT ENTERPRISES CO., LTD.Inventors: Sheng-Hung YI, Pen-Yi LIAO