Abstract: A system is disclosed to manufacture an array of multi-layer image display faceplates. Each faceplate has inner dams and outer dams forming irrigation ditches with inlets and outlets for entry and overflow of a bonding resin during its filling into the irrigation ditches. An array bonding mechanism is included for bonding the layers of the faceplate array and a bonding effluent injector array coupled to the inlets and the outlets of the faceplate array for filling the irrigation ditches with the bonding resin. The bonding effluent injector array further includes an array of glue-injecting pipings and glue-returning pipings mechanically and detachably coupled to the inlets and the outlets. A pressurized upstream glue-injecting manifold is coupled to the glue-injecting piping. A downstream glue-returning manifold is coupled to the glue-returning piping for collecting an overflow bonding resin. The system also includes an array curing mechanism for curing the filled bonding resin.

Abstract: A multi-layer image display faceplate and method of making is proposed for a micro-display or an LCD display. A layer of hard solid material is plated onto either a wafer or a glass base plate of an LCD faceplate array. The hard solid material is then coated with a photoresist and photolithographically etched into at least one parallel pair of inner dam and outer dam with the inner dam surrounding thus defining an interstitial volume and the dams forming an irrigation ditch in between. Next, either the glass base plate or the wafer is placed on top and the interstitial volume is filled with an effluent LCD material while the irrigation ditch is filled with a bonding effluent such as a resin. The resin then goes through a hardening treatment resulting in a desired multi-layer structure with an accurate gap height between the glass base plate and the wafer.

Abstract: An adjoining-type architecture and assembly method of a rear projection TV is disclosed. The TV enclosure is partitioned into interconnectable housing sections. The internal components are partitioned into interconnectable subassemblies. Each subassembly includes second adjoining devices for detachably adjoining the subassembly to corresponding housing sections. Likewise, each housing section includes first adjoining devices for detachably adjoining the housing section to corresponding subassemblies. Hence, this architecture allows low production assembly time and cost, small shipping volume, user self-assembly and self-maintenance. To effect interconnection between any two housing sections, one housing section includes third adjoining devices for mating with corresponding fourth adjoining devices provided on the other housing section. The interconnection among the subassemblies can be mechanical, electrical or an optical coupling.